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System and method for monitoring structural health of bonded components

  • US 10,210,740 B2
  • Filed: 11/09/2015
  • Issued: 02/19/2019
  • Est. Priority Date: 11/09/2015
  • Status: Active Grant
First Claim
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1. A system for monitoring structural health of bonded components, the system comprising:

  • a damage-detection module powered by electrical energy from an energy-harvesting device;

    bonded components, comprising a first bonded component and a second bonded component, wherein;

    the first bonded component and the second bonded component each comprises a contact surface;

    the first bonded component and the second bonded component are bonded at the contact surfaces by a bonding material;

    the contact surfaces face each other; and

    the first bonded component and the second bonded component comprise non-contact surfaces that do not face each other and are not bonded to each other;

    electrically-conductive ink applied onto the bonded components at the non-contact surfaces and traversing back and forth between the bonded components on the non-contact surfaces, the electrically-conductive ink forming an electrical circuit with the damage-detection module; and

    a visual-indication device electrically coupled to the damage-detection module, the visual-indication device configured to visually indicate damage to the bonded components in response to receipt of electrical energy;

    wherein the damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink.

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