System and method for monitoring structural health of bonded components
First Claim
1. A system for monitoring structural health of bonded components, the system comprising:
- a damage-detection module powered by electrical energy from an energy-harvesting device;
bonded components, comprising a first bonded component and a second bonded component, wherein;
the first bonded component and the second bonded component each comprises a contact surface;
the first bonded component and the second bonded component are bonded at the contact surfaces by a bonding material;
the contact surfaces face each other; and
the first bonded component and the second bonded component comprise non-contact surfaces that do not face each other and are not bonded to each other;
electrically-conductive ink applied onto the bonded components at the non-contact surfaces and traversing back and forth between the bonded components on the non-contact surfaces, the electrically-conductive ink forming an electrical circuit with the damage-detection module; and
a visual-indication device electrically coupled to the damage-detection module, the visual-indication device configured to visually indicate damage to the bonded components in response to receipt of electrical energy;
wherein the damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink.
1 Assignment
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Accused Products
Abstract
The present disclosure relates to a system for monitoring structural health of bonded components includes an energy-harvesting device. The system also includes a damage-detection module powered by electrical energy from the energy-harvesting device. Further, the system includes electrically-conductive ink applied onto the bonded components and across an interface between the bonded components. The electrically-conductive ink forms an electrical circuit with the damage-detection module. Additionally, the system includes a visual-indication device electrically coupled with the damage-detection module. The visual-indication device is configured to visually indicate damage to the bonded components in response to receipt of electrical energy. The damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink.
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Citations
19 Claims
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1. A system for monitoring structural health of bonded components, the system comprising:
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a damage-detection module powered by electrical energy from an energy-harvesting device; bonded components, comprising a first bonded component and a second bonded component, wherein; the first bonded component and the second bonded component each comprises a contact surface; the first bonded component and the second bonded component are bonded at the contact surfaces by a bonding material; the contact surfaces face each other; and the first bonded component and the second bonded component comprise non-contact surfaces that do not face each other and are not bonded to each other; electrically-conductive ink applied onto the bonded components at the non-contact surfaces and traversing back and forth between the bonded components on the non-contact surfaces, the electrically-conductive ink forming an electrical circuit with the damage-detection module; and a visual-indication device electrically coupled to the damage-detection module, the visual-indication device configured to visually indicate damage to the bonded components in response to receipt of electrical energy; wherein the damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of monitoring structural health of bonded components, the method comprising:
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applying electrically-conductive ink onto bonded components at non-contact surfaces and traversing back and forth between the bonded components on the non-contact surfaces to form an electrical circuit, wherein; the bonded components comprise a first bonded component and a second bonded component; the first bonded component and the second bonded component each comprises a contact surface; the first bonded component and the second bonded component are bonded at the contact surfaces by a bonding material; the contact surfaces face each other; the first bonded component and the second bonded component comprise non-contact surfaces; and the non-contact surfaces do not face each other and are not bonded to each other; converting non-electrical energy into electrical energy; transmitting the electrical energy through the electrical circuit; detecting a break in the electrically-conductive ink; and visually indicating a break in the electrically-conductive ink on a visual-indication device, powered by the electrical energy, in response to a break in the electrically-conductive ink being detected. - View Dependent Claims (16, 17, 18)
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19. A structure, comprising:
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a substrate comprising a damaged portion; a patch applied to the damaged portion of the substrate, wherein an interface is defined between the substrate and the patch, wherein the patch and substrate are bonded at contact surfaces that face each other, wherein the patch and substrate comprise non-contact surfaces that do not face each other and are not bonded to each other; an energy-harvesting device affixed to the substrate and configured to convert non-electrical energy into electrical energy; a damage-detection module affixed to the substrate and powered by electrical energy from the energy-harvesting device; electrically-conductive ink applied onto the substrate and onto the patch at the non-contact surfaces and traversing back and forth between the patch and the substrate, the electrically-conductive ink forming an electrical circuit with the damage-detection module; and a visual-indication device electrically coupled with the damage-detection module and spaced away from the electrically-conductive ink, the visual-indication device configured to visually indicate damage to the interface in response to receipt of electrical energy; wherein the damage-detection module is configured to detect a break in the electrically-conductive ink and to transmit electrical energy from the energy-harvesting device to the visual-indication device in response to detecting the break in the electrically-conductive ink.
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Specification