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Electronic device with die being sunk in substate

  • US 10,211,140 B2
  • Filed: 06/07/2017
  • Issued: 02/19/2019
  • Est. Priority Date: 06/17/2014
  • Status: Active Grant
First Claim
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1. A method for manufacturing an electronic device, comprising:

  • providing a package substrate having a package front surface and a package back surface opposed to each other and at least one through-hole crossing the package substrate between the package front surface and the package back surface;

    applying a first insulating layer of electrically insulating material onto the package front surface thereby closing the through-hole;

    sinking at least one die into the through-hole, said die including an integrated circuit, a die front surface and a die back surface opposed to each other, and one or more die terminals on the die front surface for accessing the integrated circuit;

    opening one or more first windows in the first insulating layer each one for accessing a corresponding one of the die terminals;

    forming one or more package terminals and one or more package tracks of electrically conductive material onto the first insulating layer, each package track electrically coupling a corresponding one of the package terminals with at least a corresponding one of the die terminals; and

    applying a second insulating layer of electrically insulating material onto the first insulating layer and the package tracks, the second insulating layer having one or more second windows each one for accessing a corresponding one of the package terminals.

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