Semiconductor package and method of fabricating the same
First Claim
Patent Images
1. A semiconductor package comprising:
- a semiconductor chip; and
a marking film on the semiconductor chip,the marking film including a reflection layer for reflecting an electromagnetic wave,the marking film including a thermoreactive layer on the reflection layer, andthe thermoreactive layer being configured to form a discoloration region in response to the electromagnetic wave.
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Abstract
A semiconductor package including a marking film and a method of fabricating the same are provided wherein a marking film including a thermoreactive layer may be applied to a molding layer to protect a semiconductor chip under the molding layer and to efficiently perform a marking process. The thickness of the molding layer may thereby be reduced so the entire thickness of the semiconductor package may be reduced. Also, it is possible to prevent warpage of the semiconductor package through the marking film, provide the surface of the semiconductor package with gloss and freely adjust the color of the surface of the semiconductor package.
132 Citations
19 Claims
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1. A semiconductor package comprising:
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a semiconductor chip; and a marking film on the semiconductor chip, the marking film including a reflection layer for reflecting an electromagnetic wave, the marking film including a thermoreactive layer on the reflection layer, and the thermoreactive layer being configured to form a discoloration region in response to the electromagnetic wave. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification