Light emitting devices and components having improved chemical resistance and related methods
First Claim
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1. A light emitting device comprising:
- a substrate having an upper surface and comprising a leadframe, the leadframe comprising a thermal element and one or more electrical elements, wherein the thermal element and the one or more electrical elements comprise a silver containing material, wherein the silver containing material comprises silver and/or a silver alloy, wherein the thermal element is electrically and/or thermally isolated from the one or more electrical elements;
one or more light emitting diodes (LEDs) disposed on the upper surface of the substrate;
a first protective layer disposed on and covering all of the upper surface of the substrate, the first protective layer at least partially comprising an inorganic material for increasing chemical resistance of the silver-containing material of the thermal element of the substrate and/or the one or more electrical elements of the substrate, wherein the inorganic material contains some organic component, and wherein the first protective layer comprises a substantially uniform thickness; and
a filling material disposed on portions of the one or more LEDs and on portions of the first protective layer, wherein the filling material contains a phosphor material disposed therein,wherein the leadframe, comprising the thermal element and the one or more electrical elements, comprises a material that is electrically and/or thermally conductive.
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Abstract
Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.
198 Citations
45 Claims
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1. A light emitting device comprising:
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a substrate having an upper surface and comprising a leadframe, the leadframe comprising a thermal element and one or more electrical elements, wherein the thermal element and the one or more electrical elements comprise a silver containing material, wherein the silver containing material comprises silver and/or a silver alloy, wherein the thermal element is electrically and/or thermally isolated from the one or more electrical elements; one or more light emitting diodes (LEDs) disposed on the upper surface of the substrate; a first protective layer disposed on and covering all of the upper surface of the substrate, the first protective layer at least partially comprising an inorganic material for increasing chemical resistance of the silver-containing material of the thermal element of the substrate and/or the one or more electrical elements of the substrate, wherein the inorganic material contains some organic component, and wherein the first protective layer comprises a substantially uniform thickness; and a filling material disposed on portions of the one or more LEDs and on portions of the first protective layer, wherein the filling material contains a phosphor material disposed therein, wherein the leadframe, comprising the thermal element and the one or more electrical elements, comprises a material that is electrically and/or thermally conductive. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 44)
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20. A light emitting device comprising:
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a substrate having an upper surface and comprising a leadframe, the leadframe comprising a thermal element and one or more electrical elements, wherein the thermal element and the one or more electrical elements comprise a silver containing material, wherein the silver containing material comprises silver and/or a silver alloy, wherein the thermal element is electrically and/or thermally isolated from the one or more electrical elements; one or more light emitting diodes (LEDs) disposed on the upper surface of the substrate; a first protective layer disposed on and covering all of the upper surface of the substrate, wherein the first protective layer comprises a substantially uniform thickness; and a layer of filling material disposed on the one or more LEDs and on the first protective layer, wherein the filling material contains a phosphor material disposed therein; wherein the first protective layer prevents gaseous chemicals or airborne elements that have permeated the filling material from interacting with the silver-containing material of the thermal element of the substrate and the one or more electrical elements of the substrate, wherein the leadframe, comprising the thermal element and the one or more electrical elements, comprises a material that is electrically and/or thermally conductive. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 45)
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Specification