Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

• US 10,214,109 B2
• Filed: 11/17/2014
• Issued: 02/26/2019
• Est. Priority Date: 11/28/2013
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Gohara, Hiromichi, Arai, Nobuhide
• Primary Examiner(s): Smith, Courtney
• Application Number:
  US14/895,789
• Publication Number:
  US 20160129792A1
• Time in Patent Office: 1,562 Days
• Field of Search: None
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: B60K 1/00 Arrangement or mounting of electrical propulsion units B60K7/00 takes precedence; arrangement or mounting of plural diverse prime-movers for mutual or common propulsion B60K6/00; electric transmission arrangements B60K17/12; electric equipment or propulsion of electrically-propelled vehicles per se B60L; current-collectors for power supply lines of electrically-propelled vehicles B60L5/00
• CPC Class Codes: B60K 2001/003 with means for cooling the electrical propulsion units
• CPC Class Codes: B60L 15/007 Physical arrangements or structures of drive train converters specially adapted for the propulsion motors of electric vehicles
• CPC Class Codes: B60L 3/0084 relating to control modules
• CPC Class Codes: B60L 50/10 using propulsion power supplied by engine-driven generators, e.g. generators driven by combustion engines
• CPC Class Codes: B60Y 2400/61 Arrangements of controllers for electric machines, e.g. inverters
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 7/205 : Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] details of PCBs relating to heat transfer H05K1/0201
• CPC Class Codes: H05K 7/20927 : Liquid coolant without phase change
• CPC Class Codes: Y02T 10/64 : Electric machine technologies in electromobility

Abstract

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

Claims

1. A method for manufacturing a cooler for a semiconductor module, the cooler including:

a heat sink having an appearance of a cuboid structure;

a heat radiation plate to which a semiconductor device is bonded; and

a tray-shaped cooling jacket including;

a coolant introduction channel to introduce a coolant through a coolant inlet portion;

a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and

a cooling channel between the coolant introduction and extraction channels, the method comprising;

fixing a flow rate control plate to one side of the heat sink;

arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in a direction parallel to the coolant extraction channel, and so that the flow rate control plate extends across a plurality of channels provided for the heat sink which extend orthogonally to the coolant introduction and extraction channels; and

bonding the heat radiation plate so as to close an opening of the cooling jacket.

3. The method of claim 1, wherein one end of the flow rate control plate is fixed to the heat sink at a location next to the coolant outlet portion.

4. The method of claim 1, wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the plurality of channels of the heat sink below a part of the heat radiation plate to which the semiconductor device is bonded.

5. The method of claim 1, wherein

the heat sink includes a plurality of fins arranged at predetermined intervals in a thickness direction of the fins,

each of the plurality of channels provided for the heat sink is provided between adjacent fins among the plurality of fins, and

the flow rate control plate is fixed to the plurality of fins arranged at the predetermined intervals.

13. The method of claim 1, wherein the flow rate control plate is fixed to only one side of the heat sink.

14. The method of claim 1, wherein the heat sink includes:

a base,

a plurality of fins, each extending longitudinally in a direction perpendicular to the direction parallel to the coolant extraction channel and spaced apart from one another in the direction parallel to the coolant extraction channel, to protrude upward from the base, and

the flow rate control plate, fixed to one side of the plurality of fins and extending longitudinally in the direction parallel to the coolant extraction channel, to protrude upward from the base.

15. The method of claim 14, wherein the plurality of fins have a corrugated profile.

2. A method for manufacturing a cooler for a semiconductor module, the cooler including:

a heat sink having an appearance of a cuboid structure;

a heat radiation plate to which a semiconductor device is bonded; and

a tray-shaped cooling jacket including;

a coolant introduction channel to introduce a coolant through a coolant inlet portion;

a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and

a cooling channel between the coolant introduction and extraction channels, the method comprising;

fixing a flow rate control plate to one side of the heat sink;

arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; and

bonding the heat radiation plate so as to close an opening of the cooling jacket, wherein the flow rate control plate includes;

a flow rate decreasing section standing from a lower edge of the heat sink to a first height below an upper edge of the heat sink; and

a flow rate increasing section having a second height from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

6. A cooler for a semiconductor module, comprising:

a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed;

a heat radiation plate, to which a semiconductor device is bonded; and

a tray-shaped cooling jacket including;

a coolant introduction channel to introduce a coolant through a coolant inlet portion,

a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in a direction parallel to the coolant introduction channel, and

a cooling channel provided between the coolant introduction and extraction channels,

wherein

the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in the direction parallel to the coolant introduction channel,

a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction channel and the coolant extraction channel and the flow rate control plate extends across the plurality of channels,

the heat radiation plate is fixed so as to close an opening of the cooling jacket,

an upper surface of the heat sink faces and is contact with an inner surface of the heat radiation plate, and

a lower surface of the heat sink faces and is in contact with an inner surface of the cooling jacket.

8. The cooler of claim 6, wherein one end of the flow rate control plate is fixed to the heat sink at a location next to the coolant outlet portion.

9. The cooler of claim 6, wherein the flow rate control plate has a shape that increases a flow rate of the coolant flowing through the plurality of channels of the heat sink below a part of the heat radiation plate to which the semiconductor device is bonded.

10. The cooler of claim 6, wherein

the heat sink includes a plurality of fins arranged at predetermined intervals in a thickness direction of the fins,

each of the plurality of channels provided for the heat sink is provided between adjacent fins among the plurality of fins, and

the flow rate control plate is fixed to the plurality of fins arranged at the predetermined intervals.

7. A cooler for a semiconductor module, comprising:

a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed;

a heat radiation plate, to which a semiconductor device is bonded; and

a tray-shaped cooling jacket including;

a coolant introduction channel to introduce a coolant through a coolant inlet portion,

a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in a direction parallel to the coolant introduction channel, and

a cooling channel provided between the coolant introduction and extraction channels,

wherein

the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel,

a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction channel and the coolant extraction channel,

the heat radiation plate is fixed so as to close an opening of the cooling jacket,

an upper surface of the heat sink faces and is contact with an inner surface of the heat radiation plate,

a lower surface of the heat sink faces and is in contact with an inner surface of the cooling jacket, and

the flow rate control plate includes;

a flow rate decreasing section standing from a lower edge of the heat sink to a first height below an upper edge of the heat sink, and

a flow rate increasing section having a second height from the lower edge of the heat sink which is lower than that of the flow rate decreasing section.

11. A semiconductor module, comprising:

a cooler externally supplied with a coolant, configured to cool a semiconductor device provided on an outer side of the cooler, the cooler including;

a heat sink having an appearance of a cuboid structure to one side of which a flow rate control plate is fixed,

a heat radiation plate, to which a semiconductor device is bonded, and

a tray-shaped cooling jacket including;

a coolant introduction channel to introduce a coolant through a coolant inlet portion,

a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in a direction parallel to the coolant introduction channel, and

a cooling channel between the coolant introduction and extraction channels,

wherein

the heat sink is arranged in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in the direction parallel to the coolant introduction channel,

a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction channel and the coolant extraction channel and the flow rate control plate extends across the plurality of channels,

the heat radiation plate is fixed so as to close an opening of the cooling jacket,

an upper surface of the heat sink faces and is in contact with an inner surface of the heat radiation plate, and

a lower surface of the heat sink faces and is in contact with an inner surface of the cooling jacket.

12. An electrically-driven vehicle, comprising:

the semiconductor module according to claim 11;

a motor driven by electric power provided by the semiconductor module;

a central processing unit to control the semiconductor module;

a pump to transport the coolant to cool the semiconductor module;

a heat exchanger to cool the coolant; and

a tube forming a coolant path, connecting the semiconductor module, the pump, and the heat exchanger in a closed loop, which are integrated with the cooler.