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Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle

  • US 10,214,109 B2
  • Filed: 11/17/2014
  • Issued: 02/26/2019
  • Est. Priority Date: 11/28/2013
  • Status: Active Grant
First Claim
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1. A method for manufacturing a cooler for a semiconductor module, the cooler including:

  • a heat sink having an appearance of a cuboid structure;

    a heat radiation plate to which a semiconductor device is bonded; and

    a tray-shaped cooling jacket including;

    a coolant introduction channel to introduce a coolant through a coolant inlet portion;

    a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and

    a cooling channel between the coolant introduction and extraction channels, the method comprising;

    fixing a flow rate control plate to one side of the heat sink;

    arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends longitudinally along a boundary between the coolant extraction channel and the cooling channel in a direction parallel to the coolant extraction channel, and so that the flow rate control plate extends across a plurality of channels provided for the heat sink which extend orthogonally to the coolant introduction and extraction channels; and

    bonding the heat radiation plate so as to close an opening of the cooling jacket.

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