Integrated MEMS system
First Claim
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1. An integrated micro-electro-mechanical (MEMS) system comprising:
- at least one MEMS chip comprising;
a first cap layer including a first set and a second set of first cap MEMS electrical contacts;
a second cap layer comprising second cap MEMS electrical contacts;
a central MEMS layer located between the first cap layer and the second cap layer;
at least one transducer formed in the first cap layer, the central MEMS layer and the second cap layer, the at least one transducer producing motion or sensing at least one parameter;
first insulated conducting pathways connecting said at least one transducer to the first set of first cap MEMS electrical contacts, the first insulated conducting pathways conducting electrical MEMS signals between said at least one transducer and the first set of the first cap MEMS electrical contacts; and
second insulated conducting pathways connecting the second set of first cap MEMS electrical contacts to at least one of the second cap MEMS electrical contacts, the second insulated conducting pathways extending through the first cap layer, the central MEMS layer, and the second cap layer, for conducting further signals through the MEMS chip; and
at least one signal integrated circuit (IC) chip comprising;
a first set and a second set of IC electrical contacts, the first set of IC electrical contacts being bonded to the first set of first cap MEMS electrical contacts and the second set of IC electrical contacts being bonded to the second set of first cap MEMS electrical contacts;
MEMS signal processing circuitry, operatively connected to the first set of IC electrical contacts, the MEMS signal processing circuitry configured to process the electrical MEMS signals; and
second signal processing circuitry, operatively connected to the second set of IC electrical contacts, the second signal processing circuitry configured to process the further signals.
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Abstract
An integrated MEMS system having a MEMS chip, including a MEMS transducer, and at least one IC chip, including MEMS processing circuitry, and additional circuitry to process electrical signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducer and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct electrical signals to the IC chip, to be processed by additional circuitry.
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Citations
24 Claims
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1. An integrated micro-electro-mechanical (MEMS) system comprising:
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at least one MEMS chip comprising; a first cap layer including a first set and a second set of first cap MEMS electrical contacts; a second cap layer comprising second cap MEMS electrical contacts; a central MEMS layer located between the first cap layer and the second cap layer; at least one transducer formed in the first cap layer, the central MEMS layer and the second cap layer, the at least one transducer producing motion or sensing at least one parameter; first insulated conducting pathways connecting said at least one transducer to the first set of first cap MEMS electrical contacts, the first insulated conducting pathways conducting electrical MEMS signals between said at least one transducer and the first set of the first cap MEMS electrical contacts; and second insulated conducting pathways connecting the second set of first cap MEMS electrical contacts to at least one of the second cap MEMS electrical contacts, the second insulated conducting pathways extending through the first cap layer, the central MEMS layer, and the second cap layer, for conducting further signals through the MEMS chip; and at least one signal integrated circuit (IC) chip comprising; a first set and a second set of IC electrical contacts, the first set of IC electrical contacts being bonded to the first set of first cap MEMS electrical contacts and the second set of IC electrical contacts being bonded to the second set of first cap MEMS electrical contacts; MEMS signal processing circuitry, operatively connected to the first set of IC electrical contacts, the MEMS signal processing circuitry configured to process the electrical MEMS signals; and second signal processing circuitry, operatively connected to the second set of IC electrical contacts, the second signal processing circuitry configured to process the further signals. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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Specification