Placement method for circuit carrier and circuit carrier

• US 10,217,675 B2
• Filed: 08/26/2015
• Issued: 02/26/2019
• Est. Priority Date: 02/28/2013
• Status: Active Grant

• Current Assignee: AB Mikroelektronik Gesellschaft Mit Beschraenkter Haftung (Kyocera Corporation)
• Original Assignee: AB Mikroelektronik Gesellschaft Mit Beschraenkter Haftung (Kyocera Corporation)
• Inventors: Karch, Andreas
• Primary Examiner(s): Maruf, Sheikh
• Application Number:
  US14/836,049
• Publication Number:
  US 20150364384A1
• Time in Patent Office: 1,280 Days
• Field of Search: 438 4
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2224/2732 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/29294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/75745 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/831 the layer connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/83101 as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83122 by detecting inherent features of, or outside, the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83815 Reflow soldering
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 2224/83885 Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/83855 - H01L2224/8388, e.g. for hybrid thermoplastic-thermosetting adhesives
• CPC Class Codes: H01L 2224/83905 Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/13 : the devices being of a type provided for in group H01L33/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 33/486 : adapted for surface mounting
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0269 : for visual or optical inspection
• CPC Class Codes: H05K 13/046 : Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 13/0812 : the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
• CPC Class Codes: H05K 13/0815 : Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/166 : Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/321 : by conductive adhesives
• CPC Class Codes: H05K 3/341 : Surface mounted components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).

Claims

1. A process for the production of a circuit carrier equipped with at least one surface-mount LED (SMD-LED) for a motor vehicle, wherein the at least one SMD-LED is positioned in oriented relationship to one or more reference points of the circuit carrier on the circuit carrier, wherein a position of a light-emitting region of the at least one SMD-LED is optically detected in the SMD-LED by illuminating the SMD-LED with a light source that is separate from the SMD-LED, and wherein the at least one SMD-LED is mounted to the circuit carrier in dependence on the detected position of the light-emitting region of the at least one SMD-LED.

2. A process according to claim 1, wherein the position of the light-emitting region is determined in all three dimensions (X, Y, Z) and an angular position is determined relative to an axis of rotation at a right angle to a plane of the SMD-LED.

3. A process according to claim 1, wherein mounting of the at least one SMD-LED to the circuit carrier is affected in dependence on the position of a centre point of the light-emitting region of the at least one SMD-LED.

4. A process according to claim 1, wherein at least one of the one or more reference points is used for positioning an optical system for the at least one SMD-LED.

5. A process according to claim 1, wherein a wavelength of the light source ranges from 400 nm to 500 nm.

6. A process according to claim 1, wherein for mounting the at least one SMD-LED to the circuit carrier, silver sintering material is arranged at the at least one SMD-LED after orientation has been affected, and the at least one SMD-LED is sintered on to the circuit earner.

7. A process according to claim 6, wherein the silver sintering material has a particle size of less than about 100 nm.

8. A process according to claim 7, wherein the silver sintering material is selected with a particle size in a range of about 20 nm to about 40 nm.

9. A process according to claim 1, wherein mounting the at least one SMD-LED to the circuit carrier comprises:

applying solder paste to the circuit carrier;

applying an adhesive to the circuit carrier;

partially hardening the adhesive after positioning the at least one SMD-LED on the circuit carrier; and

reflow soldering the solder paste.

10. A process according to claim 4, wherein the at least one of the one or more reference points is used for fixing the optical system for the at least one SMD-LED.

11. A process according to claim 6, wherein for the mounting the at least one SMD-LED to the circuit carrier, the silver sintering material is arranged at the at least one SMD-LED after the orientation has been affected, and the at least one SMD-LED is sintered upon and/or by pressing the at least one SMD-LED on to the circuit carrier.

12. A process according to claim 7, wherein the particle size of the silver sintering material is less than about 60 nm.

13. A process according to claim 9, wherein the solder paste is applied to the circuit carrier by printing thereon, and the adhesive is applied to the circuit carrier in dependence on the detected position of the light-emitting region of the at least one SMD-LED.

14. A process according to claim 1, wherein a wavelength of the light source ranges from 420 nm to 490 nm.