Display device and method of manufacturing the display device

• US 10,217,678 B2
• Filed: 06/08/2017
• Issued: 02/26/2019
• Est. Priority Date: 06/14/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Liu, Tung-Kai, Hsieh, Tsau-Hua, Chu, Wei-Cheng, Lin, Chun-Hsien, Lius, Chandra, Hung, Ting-Kai, Lee, Kuan-Feng, Lin, Ming-Chang, Yan, Tzu-Min, Wang, Hui-Chieh
• Primary Examiner(s): Faragalla, Michael
• Application Number:
  US15/617,191
• Publication Number:
  US 20170358503A1
• Time in Patent Office: 628 Days
• CPC Class Codes: B65G 43/08 Control devices operated by article or material being fed, conveyed or discharged and controlling the discharging devices B65G47/42
• CPC Class Codes: G01R 31/26 Testing of individual semiconductor devices testing or measuring during manufacture or treatment H01L22/00; testing of photovoltaic devices H02S50/10
• CPC Class Codes: G09G 2300/0426 Layout of electrodes and connections
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/124 with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1248 with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
• CPC Class Codes: H01L 27/1255 integrated with passive devices, e.g. auxiliary capacitors
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods
• CPC Class Codes: H01L 27/1262 with a particular formation, treatment or coating of the substrate
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A display device includes a substrate, a first transistor, a second transistor and a conductive connection portion disposed on the substrate. The first transistor is electrically connected to the gate electrode of the second transistor through the conductive connection portion. An insulating layer is disposed on the conductive connection portion. A pixel electrode is disposed on the insulating layer and is electrically connected to the second transistor. The pixel electrode is at least partially overlapped with the conductive connection portion. A light-emitting element is disposed on the pixel electrode. The conductive connection portion and the pixel electrode form a capacitor. The capacitor has an equivalent permittivity and a thickness. The ratio of the equivalent permittivity to the thickness is in a range from 0.4*(1E+5)F/m^2 to 296.48*(1E+5)F/m^2.

Claims

1. A display device, comprising:

a substrate;

a first transistor disposed on the substrate;

a second transistor disposed on the substrate, and the second transistor comprises a gate electrode;

a conductive connection portion disposed on the substrate, and the first transistor is electrically connected to the gate electrode of the second transistor through the conductive connection portion;

an insulating layer disposed on the conductive connection portion;

a pixel electrode disposed on the insulating layer and electrically connected to the second transistor, wherein the pixel electrode is at least partially overlapped with the conductive connection portion; and

a light-emitting element disposed on the pixel electrode;

wherein the conductive connection portion and the pixel electrode form a capacitor, the capacitor has an equivalent permittivity and a thickness, and a ratio of the equivalent permittivity to the thickness is in a range from 0.4*(1E+5)F/m^2 to 296.48*(1E+5)F/m^2.

2. The display device as claimed in claim 1, wherein the conductive connection portion and the gate electrode of the second transistor are in the same layer.

3. The display device as claimed in claim 2, wherein the ratio is further in a range from 0.4*(1E+5)F/m^2 to 88.5*(1E+5)F/m^2.

4. The display device as claimed in claim 1, wherein the second transistor further comprises a source electrode, and the conductive connection portion and the source electrode of the second transistor are in the same layer.

5. The display device as claimed in claim 4, wherein the ratio is further in a range from 0.45*(1E+5)F/m^2 to 296.48*(1E+5)F/m^2.

6. The display device as claimed in claim 4, further comprising an auxiliary electrode disposed between the substrate and the conductive connection portion, wherein the auxiliary electrode is at least partially overlapped with the conductive connection portion.

7. The display device as claimed in claim 1, further comprising an auxiliary electrode disposed between the substrate and the conductive connection portion, wherein the auxiliary electrode is at least partially overlapped with the conductive connection portion.

8. The display device as claimed in claim 1, wherein the light-emitting element is not overlapped with the gate electrode of the second transistor.

9. The display device as claimed in claim 1, further comprising:

a control circuit unit, wherein the substrate is positioned between the control circuit unit and the first transistor; and

a signal connection portion, wherein the control circuit unit is electrically connected to the first transistor through the signal connection portion.

10. The display device as claimed in claim 9, wherein the signal connection portion passes through the substrate.

11. The display device as claimed in claim 1, further comprising:

a third patterned conductive layer disposed on the insulating layer, wherein the third patterned conductive layer comprises a third electrode and a fourth electrode,

wherein the light-emitting element comprises a fifth electrode and a sixth electrode, the third electrode of the third patterned conductive layer is electrically connected to the fifth electrode, and the fourth electrode is electrically connected to the sixth electrode,

wherein at least one of the third electrode and the fourth electrode has a first portion and a second portion, and a thickness of the first portion is greater than that of the second portion.

12. A method for forming a display device, comprising:

providing a substrate having a first surface;

forming a transistor layer on the first surface of the substrate; and

forming a patterned anisotropic conductive film on the transistor layer, wherein the patterned anisotropic conductive film comprises a plurality of anisotropic conductive regions,

wherein forming the patterned anisotropic conductive film comprises;

providing an imprinting die, wherein a major surface of the imprinting die has a plurality of protrusion portions which form an imprint pattern;

immersing the major surface of the imprinting die into an anisotropic conductive solution to form an anisotropic conductive coating on the plurality of protrusion portions of the major surface of the imprinting die;

performing an imprinting process on the transistor layer using the imprinting die to imprint the anisotropic conductive coating on the plurality of protrusion portions on the transistor layer, and forming the patterned anisotropic conductive film on the transistor layer.

13. The method as claimed in claim 12, wherein there is one or more patterned anisotropic conductive film predetermined coating regions on the transistor layer, corresponding to a pattern of the patterned anisotropic conductive film, and forming the patterned anisotropic conductive film comprises:

providing spray coating equipment having a plurality of spray nozzles oriented towards the transistor layer;

aligning one or more of the spray nozzles with the one or more patterned anisotropic conductive film predetermined coating regions;

coating an anisotropic conductive solution on the one or more patterned anisotropic conductive film predetermined coating regions through one or more of the spray nozzles that are aligned with the one or more patterned anisotropic conductive film predetermined coating regions to form the patterned anisotropic conductive film.

14. The method as claimed in claim 12, further comprising:

providing a pickup device comprising a substrate and a plurality of pickup units disposed on the substrate, wherein each of the pickup units comprises;

a gate electrode disposed on the substrate;

a gate dielectric layer disposed on the gate electrode;

a semiconductor layer disposed on the gate dielectric layer and corresponding to the gate electrode;

a first electrode and a second electrode, wherein the first electrode and the second electrode are respectively at least partially overlapped with the semiconductor layer;

an insulating layer disposed on the first electrode, the second electrode and the semiconductor layer; and

a third electrode disposed on the insulating layer and electrically connected to the second electrode.

15. The method as claimed in claim 14, wherein the display device comprises a plurality of sub-pixel regions on the transistor layer, and each of the sub-pixel regions has two light-emitting element predetermined disposing regions, and the method further comprises:

providing a carrier substrate, wherein there is a plurality of light-emitting elements disposed on the carrier substrate, and each of the light-emitting elements corresponds to one of the light-emitting element predetermined disposing regions;

performing a test on the light-emitting elements;

selectively picking up the light-emitting elements that pass the test using the pickup device, and disposing the light-emitting elements that pass the test at the corresponding light-emitting element predetermined disposing regions on the transistor layer.

16. The method as claimed in claim 14, wherein the display device comprises a plurality of sub-pixel regions on the transistor layer, and each of the sub-pixel regions has one light-emitting element predetermined disposing region, and the method further comprises:

providing a carrier substrate, wherein there are a plurality of light-emitting elements disposed on the carrier substrate, and each of the light-emitting elements corresponds to one of the light-emitting element predetermined disposing regions;

performing a test on the light-emitting elements;

selectively picking up the light-emitting elements that pass the test using the pickup device, and disposing the light-emitting elements that pass the test at the corresponding light-emitting element predetermined disposing regions on the transistor layer, wherein there is no light-emitting element disposed at the one or more light-emitting element predetermined disposing regions that correspond to the one or more light-emitting elements not passing the test;

picking up another one or more of the light-emitting elements that pass the test to be disposed at the one or more light-emitting element predetermined disposing regions that correspond to the one or more light-emitting elements not passing the test.

17. The method as claimed in claim 12, wherein the display device comprises at least one light-emitting element predetermined disposing region on the transistor layer, and the method further comprises:

providing a carrier substrate, wherein there is at least one light-emitting element disposed on the carrier substrate and corresponding to the light-emitting element predetermined disposing region;

providing a pickup device, wherein the pickup device comprises a plurality of pickup units, and wherein each of the pickup units comprises a calibration unit and a pickup head connected to the calibration unit, wherein the calibration unit comprises a piezoelectric material;

picking up the light-emitting element using the pickup device, and disposing the light-emitting element at a position that approximately corresponds to the light-emitting element predetermined disposing region; and

applying a voltage to the calibration unit to change the size of the calibration unit and moving or rotating the pickup head and the light-emitting element, so that the light-emitting element is aligned with the light-emitting element predetermined disposing region.

18. The method as claimed in claim 12, wherein the display device comprises a plurality of light-emitting element predetermined disposing regions on the transistor layer, and the method further comprises:

providing a carrier substrate, wherein there is a plurality of light-emitting elements disposed on the carrier substrate, and each of the light-emitting elements corresponds to one of the light-emitting element predetermined disposing regions;

providing a pickup device, wherein the pickup device comprises a piezoelectric unit matrix, and wherein the piezoelectric unit matrix has a plurality of piezoelectric units;

picking up the light-emitting elements using the pickup device, wherein each of the light-emitting elements corresponds to one of the piezoelectric units;

applying a voltage to one or more of the piezoelectric units to change the size of the one or more piezoelectric units, and moving or rotating the one or more light-emitting elements disposed corresponding to the one or more piezoelectric units, so that the one or more light-emitting elements is aligned with the light-emitting element predetermined disposing region.

19. The method as claimed in claim 12, further comprising:

providing a pickup device, wherein the pickup device comprises a plurality of pickup units, and each of the pickup units comprises a pickup head and a light-emitting unit disposed adjacent to the pickup head;

picking up a light-emitting element using the pickup head of at least one of the pickup units, and disposing the light-emitting element on the anisotropic conductive block; and

emitting light from the light-emitting unit to irradiate the anisotropic conductive block that has the light-emitting element disposed thereon to harden the anisotropic conductive block.