Thin film transistor and manufacturing method thereof, array substrate, and display device
First Claim
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1. A method of manufacturing a thin film transistor, comprising:
- forming a gate electrode, an active layer, source/drain electrodes, one or more insulating layers and a pixel electrode on a base substrate,wherein at least one of the insulating layers comprises a silicon oxide sub-layer contacting the active layer and a silicon oxide sub-layer not contacting the active layer, and the silicon oxide sub-layer not contacting the active layer has a hydrogen content higher than that of the silicon oxide sub-layer contacting the active layer, andwherein the method comprising;
depositing the silicon oxide sub-layer contacting the active layer at 200-300°
C. with a silane gas flow rate of 300-800 sccm and depositing the silicon oxide sub-layer not contacting the active layer at 240-340°
C. with a silane gas flow rate of 600-1200 sccm, in order that the hydrogen content of the silicon oxide sub-layer not contacting the active layer is 5%˜
10%, and the hydrogen content of the silicon oxide sub-layer contacting the active layer is 1%˜
5%.
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Abstract
The technical disclosure relates to a thin film transistor and a manufacturing method thereof, an array substrate and a display device. The thin film transistor comprises a base substrate, a gate electrode, an active layer, source/drain electrodes, a pixel electrode and one or more insulating layers, wherein at least one of the insulating layers comprises a bottom insulating sub-layer and a top insulating sub-layer, the top insulating sub-layer having a hydrogen content higher than that of the bottom insulating sub-layer.
20 Citations
10 Claims
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1. A method of manufacturing a thin film transistor, comprising:
- forming a gate electrode, an active layer, source/drain electrodes, one or more insulating layers and a pixel electrode on a base substrate,
wherein at least one of the insulating layers comprises a silicon oxide sub-layer contacting the active layer and a silicon oxide sub-layer not contacting the active layer, and the silicon oxide sub-layer not contacting the active layer has a hydrogen content higher than that of the silicon oxide sub-layer contacting the active layer, and wherein the method comprising;
depositing the silicon oxide sub-layer contacting the active layer at 200-300°
C. with a silane gas flow rate of 300-800 sccm and depositing the silicon oxide sub-layer not contacting the active layer at 240-340°
C. with a silane gas flow rate of 600-1200 sccm, in order that the hydrogen content of the silicon oxide sub-layer not contacting the active layer is 5%˜
10%, and the hydrogen content of the silicon oxide sub-layer contacting the active layer is 1%˜
5%. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- forming a gate electrode, an active layer, source/drain electrodes, one or more insulating layers and a pixel electrode on a base substrate,
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10. A method of manufacturing a thin film transistor, comprising:
- forming a gate electrode, an active layer, source/drain electrodes, one or more insulating layers and a pixel electrode on a base substrate,
wherein at least one of the insulating layers comprises a silicon oxide sub-layer contacting the active layer and a silicon oxide sub-layer not contacting the active layer, and the silicon oxide sub-layer not contacting the active layer has a hydrogen content higher than that of the silicon oxide sub-layer contacting the active layer, wherein the method comprising;
depositing the silicon oxide sub-layer contacting the active layer at 200-300°
C. with a silane gas flow rate of 300-800 sccm and depositing the silicon oxide sub-layer not contacting the active layer at 240-340°
C. with a silane gas flow rate of 600-1200 sccm, in order that the hydrogen content of the silicon oxide sub-layer not contacting the active layer is 5%˜
10%, and the hydrogen content of the silicon oxide sub-layer contacting the active layer is 1%˜
5%, andwherein a thickness of the silicon oxide sub-layer contacting the active layer is smaller than a thickness of the silicon oxide sub-layer not contacting the active layer.
- forming a gate electrode, an active layer, source/drain electrodes, one or more insulating layers and a pixel electrode on a base substrate,
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