Semiconductor package with multiple compartments

• US 10,221,064 B2
• Filed: 03/23/2018
• Issued: 03/05/2019
• Est. Priority Date: 03/02/2017
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Natan, Lawrence Prestousa, Arcedera, Adrian, Lledo-Reyes, Roveluz, Torrefranca, Sarah Christine-Sanchez
• Primary Examiner(s): Prenty, Mark
• Application Number:
  US15/934,267
• Publication Number:
  US 20180251369A1
• Time in Patent Office: 347 Days
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/48479 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

Claims

1. A semiconductor device, comprising:

a lower substrate comprising an upper surface;

a plurality of electrical components including a lower electrical component mounted to the upper surface of the lower substrate;

an upper substrate directly molded over at least a portion of the lower electrical component and the upper surface of the lower substrate, wherein the upper substrate encapsulates at least the portion of the lower electrical component;

a cavity in the upper substrate, the cavity extending through an upper surface of the upper substrate and including, therein, an upper electrical component from the plurality of electrical components; and

a lid covering the cavity, the lid including at least one port through which a sensor from the plurality of electrical components interacts with an environment external to the semiconductor device.

2. The semiconductor device of claim 1, further comprising:

a plurality of bond pads;

wherein the upper substrate further comprises a pass-through aligned with the plurality of bond pads; and

wherein the upper electrical component is electrically coupled to the plurality of bond pads via a plurality of wires that traverse the pass-through.

3. The semiconductor device of claim 1, wherein the upper substrate further comprises a pass-through that provides a pathway for a plurality of wires from the cavity.

4. The semiconductor device of claim 1, wherein the sensor includes the upper electrical component.

5. The semiconductor device of claim 1, wherein the lower electrical component is configured to sense properties of the environment while being sealed from the environment.

6. The semiconductor device of claim 1, further comprising:

one or more package terminals that are electrically coupled to one or more ground pads on the upper surface of the lower substrate;

wherein the upper substrate further comprises one or more ground paths passing between the upper surface and a lower surface of the upper substrate; and

wherein the one or more ground paths electrically couple the lid to the one or more ground pads.

7. The semiconductor device of claim 1, wherein:

the upper electrical component comprises a micro-electro mechanical systems (MEMS) environment sensor device; and

the lower electrical component comprises a MEMS inertial measurement sensor device.

8. The semiconductor device of claim 1, wherein:

the upper electrical component comprises a micro-electro mechanical systems (MEMS) microphone device having an input port aligned with the at least one port in the lid and a diaphragm that vibrates in response to sound waves received via the at least one port in the lid;

the cavity comprises a compartment having a mounting surface to receive the upper electrical component; and

the mounting surface further comprising a backing cavity aligned with the diaphragm to provide the microphone device with a backing volume.

9. The semiconductor device of claim 1, wherein the sensor is configured to sense properties of the environment external based on light received via the at least one port.

10. A semiconductor device comprising:

a substrate comprising an upper surface;

a first electrical component mounted to the upper surface of the substrate;

a polymer material encapsulating the substrate and contacting at least a top portion of the first electrical component;

a cavity in the polymer material, the cavity extending through an upper surface of the polymer material;

a second electrical component in the cavity; and

a lid covering the cavity, the lid comprising at least one port through which the second electrical component interacts with an environment external to the semiconductor device.

11. The semiconductor device of claim 10, further comprising:

a plurality of bond pads; and

wherein the second electrical component is coupled to the plurality of bond pads via a plurality of wires that traverse a pass-through in the polymer material.

12. The semiconductor device of claim 10, further comprising a plurality of wires that traverse a pass-through in the polymer material, the pass-through providing a pathway between the cavity and the substrate.

13. The semiconductor device of claim 10, wherein:

the first electrical component comprises a first MEMS device configured to sense properties of the environment while being sealed from the environment; and

the second electrical component comprises a second MEMS device configured to sense properties of the environment through the at least one port.

14. The semiconductor device of claim 10, further comprising:

one or more package terminals that are electrically coupled to one or more ground pads on the upper surface of the substrate; and

one or more ground paths that pass between the upper surface and a lower surface of the polymer material and electrically couple the lid to the one or more ground pads.

15. The semiconductor device of claim 10, wherein:

the first electrical component comprises an inertial measurement sensor device; and

the second electrical component comprises an environment sensor device.

16. The semiconductor device of claim 10, wherein the second electrical component comprises a MEMS microphone device having an input port aligned with the port in the lid and a diaphragm that vibrates in response to sound waves received via the port in the lid.

17. A semiconductor device comprising:

a first substrate;

a molded substrate on the first substrate, the molded substrate comprising a polymer defining;

a first cavity; and

a second cavity extending over the first cavity;

a first electrical component having lateral sides bounded by the first cavity; and

a second electrical component having lateral sides bounded by the second cavity.

18. The semiconductor device of claim 17, wherein:

at least a top section of the first electrical component is separated from the polymer; and

at least a top section of the second electrical component is separated from the polymer.

19. The semiconductor device of claim 17, wherein the polymer defines:

a first sidewall of the first cavity;

a second sidewall of the second cavity; and

a ledge from the first sidewall to the second sidewall.

20. The semiconductor device of claim 17, wherein the molded substrate further comprises a pass-through that provides a pathway for a plurality of wires from the second cavity.