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Semiconductor package with multiple compartments

  • US 10,221,064 B2
  • Filed: 03/23/2018
  • Issued: 03/05/2019
  • Est. Priority Date: 03/02/2017
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a lower substrate comprising an upper surface;

    a plurality of electrical components including a lower electrical component mounted to the upper surface of the lower substrate;

    an upper substrate directly molded over at least a portion of the lower electrical component and the upper surface of the lower substrate, wherein the upper substrate encapsulates at least the portion of the lower electrical component;

    a cavity in the upper substrate, the cavity extending through an upper surface of the upper substrate and including, therein, an upper electrical component from the plurality of electrical components; and

    a lid covering the cavity, the lid including at least one port through which a sensor from the plurality of electrical components interacts with an environment external to the semiconductor device.

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