Light emitter components and methods having improved electrical contacts

• US 10,222,032 B2
• Filed: 03/13/2013
• Issued: 03/05/2019
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Reiherzer, Jesse Colin, Hussell, Christopher P.
• Primary Examiner(s): Hanley, Britt D
• Application Number:
  US13/800,260
• Publication Number:
  US 20130279169A1
• Time in Patent Office: 2,183 Days
• Field of Search: None
• CPC Class Codes: F21V 19/001 the light sources being semiconductors devices, e.g. LEDs
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.

Claims

1. A light emitter component comprising:

a submount;

at least one light emitter chip on the submount;

at least one electrical contact disposed along portions of at least three external surfaces of the submount, wherein the at least one electrical contact is spaced apart from the at least one light emitter chip and electrically connected to the at least one light emitter chip via a wirebond; and

a reflective retention material disposed over the submount, wherein the reflective retention material covers portions of the wirebond for improving light extraction,

wherein the at least one light emitter chip is mounted on the submount without an electrically conductive material being disposed between the at least one light emitter chip and the submount, and

wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the wirebond is attached thereto.

2. The light emitter component of claim 1, wherein the at least one electrical contact comprises a top contact portion, a bottom contact portion, and a side contact portion.

3. The light emitter component of claim 2, wherein each of the top, bottom, and side contact portions comprise areas of electroplated metal.

4. The light emitter component of claim 2, wherein the side contact portion comprises a sawn thru-hole.

5. The light emitter component of claim 2, wherein the side contact portion physically connects the top contact portion to the bottom contact portion.

6. The light emitter component of claim 2, wherein the side contact portion electrically connects the top contact portion to the bottom contact portion.

7. The light emitter component of claim 2, wherein the side contact portion substantially covers a full width of a lateral side of the submount.

8. The light emitter component of claim 2, wherein the side contact portion is disposed over a portion of a lateral side of the submount.

9. The light emitter component of claim 2, wherein the side contact portion comprises an area of conductive paste, ink, epoxy, metal, an exposed metallic via, or an end cap.

10. The light emitter component of claim 1, wherein the submount comprises a ceramic material.

11. The emitter component of claim 10, wherein the ceramic material comprises aluminum oxide.

12. The light emitter component of claim 1, wherein the at least one light emitter chip comprises either a growth substrate or a carrier substrate.

13. The light emitter component of claim 1, further comprising an optical element disposed over a portion of at least one of the three external surfaces of the submount.

14. A light emitter component comprising:

a submount;

at least one light emitter chip on the submount;

an electrical contact comprising a top contact portion, a bottom contact portion, and a side contact portion disposed between the top contact portion and the bottom contact portion, wherein the top, bottom, and side contact portions are external from and in contact with the submount; and

a reflective retention material disposed over the submount, wherein the reflective retention material is at least partially disposed over the top contact portion for improving light extraction,

wherein the at least one light emitter chip is mounted on the submount without an electrically conductive material being disposed between the at least one light emitter chip and the submount, and

wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact.

15. The light emitter component of claim 14, wherein the side contact portion comprises an area of conductive paste, ink, epoxy, metal, an exposed metallic via, or an end cap.

16. The light emitter component of claim 14, wherein the top contact portion, the bottom contact portion, and the side contact portion comprise areas of electroplated metal.

17. The light emitter component of claim 16, wherein the areas of electroplated metal comprise at least one material selected from the group consisting of silver, copper, nickel, gold, palladium, and combinations thereof.

18. The light emitter component of claim 14, wherein the at least one light emitter chip is wirebonded to the top contact portion.

19. The light emitter component of claim 14, wherein the bottom contact portion is soldered to an external substrate or heat sink.

20. The light emitter component of claim 14, wherein the reflective retention material is disposed at least partially about the at least one light emitter chip.

21. The light emitter component of claim 20, wherein an encapsulant is disposed between one or more walls of the reflective retention material.

22. The light emitter component of claim 14, wherein an encapsulant is disposed over the at least one light emitter chip.

23. The light emitter component of claim 14, wherein the submount comprises a ceramic material.

24. The light emitter component of claim 23, wherein the submount comprises aluminum oxide.

25. The light emitter component of claim 14, wherein the at least one light emitter chip is mounted to the submount via an adhesive layer.

26. The light emitter component of claim 14, wherein each of the side contact portion, the top contact portion, and the bottom contact portion are comprised of a same electrically conductive material.

27. The light emitter component of claim 14, wherein the top and bottom contact portions comprise a first electrically conductive material and the side contact portion comprises a second electrically conductive material that is different from the first electrically conductive material.

28. The light emitter component of claim 14, comprising three light emitter chips.

29. The light emitter component of claim 14, comprising six light emitter chips.

30. The light emitter component of claim 14, further comprising an optical element disposed over at least one of the top contact portion, the bottom contact portion, or the side contact portion.

31. A light emitter component comprising:

a submount;

at least one light emitter chip disposed over the submount;

first and second electrically conductive side contact portions disposed on a same external face of the submount and extending substantially parallel to each other between a top surface and a bottom surface of the submount; and

a top contact portion electrically communicating with the first and second electrically conductive side contact portions, wherein the at least one light emitter chip is wirebonded to the top contact portion and the top contact portion is external to the submount.

32. The light emitter component of claim 31, wherein the side contact portions are spaced apart from each other along external lateral sides of the submount.

33. The light emitter component of claim 31, wherein the side contact portions physically and electrically connect the top contact portions to respective bottom contact portions.

34. The light emitter component of claim 31, wherein the side contact portions comprise areas of conductive paste, ink, epoxy, metal, an exposed metallic via, or an end cap.

35. The light emitter component of claim 31, wherein the at least two top contact portions, a bottom contact portion, and the first and second side contact portions comprise areas of electroplated metal.

36. The light emitter component of claim 35, wherein the electroplated metal comprises at least one metal selected from the group consisting of silver, copper, nickel, gold, palladium, and combinations thereof.

37. The light emitter component of claim 31, wherein the submount comprises a ceramic material.

38. The light emitter component of claim 37, wherein the submount comprises aluminum oxide.

39. The light emitter component of claim 31, further comprising an optical element disposed over the submount.

40. A method of providing a light emitter component, the method comprising:

providing a submount;

providing at least one light emitter chip on the submount without any electrically conductive material being disposed between the at least one light emitter chip and the submount;

applying metal to at least a portion of one or more external lateral sides of the submount for electrically connecting a top contact portion to a bottom contact portion;

connecting the at least one light emitter chip to the top contact portion via a wirebond; and

dispensing a reflective retention material over the submount, wherein all of the reflective retention material covers portions of the wirebond for improving light extraction,

wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the wirebond is attached thereto.

41. The method according to claim 40, wherein applying metal comprises electroplating at least a portion of the one or more external lateral sides of the submount.

42. The method according to claim 40, wherein applying metal comprises chemically or physically depositing metal to at least a portion of the one or more external lateral sides of the submount.

43. The method according to claim 40, wherein providing the at least one light emitter chip over the submount comprises mounting the at least one light emitter chip directly to a top surface of the submount.

44. The method according to claim 40, wherein providing a submount comprises providing a ceramic submount.

45. The method according to claim 40, further comprising providing an optical element over a portion of least one of the top contact portion, the bottom contact portion, or the one or more external lateral sides.

46. A method of providing a light emitter component, the method comprising:

providing a submount;

providing at least one light emitter chip over the submount;

exposing a plurality of electrically conductive vias such that portions of the vias are disposed along one external lateral side of the submount for electrically connecting a top contact portion to a bottom contact portion, wherein the top contact portion is external to the submount; and

connecting the at least one light emitter chip to the top contact portion by at least one wirebond,

wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the at least one wirebond is attached thereto.

47. The method according to claim 46, wherein providing the at least one light emitter chip over the submount comprises mounting the at least one chip directly to a top surface of the submount.

48. The method according to claim 46, wherein providing a submount comprises providing a ceramic submount.

49. The method according to claim 46, wherein exposing the plurality of electrically conductive vias comprises sawing through the electrically conductive vias.

50. The method according to claim 46, further comprising providing an optical element over a portion of least one of the top contact portion, the bottom contact portion, or the one or more external lateral sides.

51. A light emitter component comprising:

a submount;

a light emitting diode (LED) chip disposed on the submount without any electrically conductive material being disposed between the at least one light emitter chip and the submount; and

an electrical contact;

wherein the electrical contact wraps around and is in contact with at least three external surfaces of the submount;

wherein a first portion of the electrical contact is disposed along a first of the at least three external surfaces, which is orthogonal to a second portion of the electrical contact disposed along a second of the at least three external surfaces;

wherein a reflective retention material is disposed over the submount and at least partially disposed over the first portion of the electrical contact for improving light extraction;

wherein the first portion of the electrical contacts is entirely external to the submount; and

wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact.

52. The light emitter component of claim 51, further comprising an optical element disposed over a portion of at least one of the at least three external surfaces of the submount.

53. The light emitter component of claim 51, further comprising an optical element disposed over a portion of at least one of six external surfaces of the submount.