Light emitter components and methods having improved electrical contacts
First Claim
Patent Images
1. A light emitter component comprising:
- a submount;
at least one light emitter chip on the submount;
at least one electrical contact disposed along portions of at least three external surfaces of the submount, wherein the at least one electrical contact is spaced apart from the at least one light emitter chip and electrically connected to the at least one light emitter chip via a wirebond; and
a reflective retention material disposed over the submount, wherein the reflective retention material covers portions of the wirebond for improving light extraction,wherein the at least one light emitter chip is mounted on the submount without an electrically conductive material being disposed between the at least one light emitter chip and the submount, andwherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the wirebond is attached thereto.
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Abstract
Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.
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Citations
53 Claims
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1. A light emitter component comprising:
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a submount; at least one light emitter chip on the submount; at least one electrical contact disposed along portions of at least three external surfaces of the submount, wherein the at least one electrical contact is spaced apart from the at least one light emitter chip and electrically connected to the at least one light emitter chip via a wirebond; and a reflective retention material disposed over the submount, wherein the reflective retention material covers portions of the wirebond for improving light extraction, wherein the at least one light emitter chip is mounted on the submount without an electrically conductive material being disposed between the at least one light emitter chip and the submount, and wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the wirebond is attached thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A light emitter component comprising:
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a submount; at least one light emitter chip on the submount; an electrical contact comprising a top contact portion, a bottom contact portion, and a side contact portion disposed between the top contact portion and the bottom contact portion, wherein the top, bottom, and side contact portions are external from and in contact with the submount; and a reflective retention material disposed over the submount, wherein the reflective retention material is at least partially disposed over the top contact portion for improving light extraction, wherein the at least one light emitter chip is mounted on the submount without an electrically conductive material being disposed between the at least one light emitter chip and the submount, and wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A light emitter component comprising:
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a submount; at least one light emitter chip disposed over the submount; first and second electrically conductive side contact portions disposed on a same external face of the submount and extending substantially parallel to each other between a top surface and a bottom surface of the submount; and a top contact portion electrically communicating with the first and second electrically conductive side contact portions, wherein the at least one light emitter chip is wirebonded to the top contact portion and the top contact portion is external to the submount. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of providing a light emitter component, the method comprising:
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providing a submount; providing at least one light emitter chip on the submount without any electrically conductive material being disposed between the at least one light emitter chip and the submount; applying metal to at least a portion of one or more external lateral sides of the submount for electrically connecting a top contact portion to a bottom contact portion; connecting the at least one light emitter chip to the top contact portion via a wirebond; and dispensing a reflective retention material over the submount, wherein all of the reflective retention material covers portions of the wirebond for improving light extraction, wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the wirebond is attached thereto. - View Dependent Claims (41, 42, 43, 44, 45)
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46. A method of providing a light emitter component, the method comprising:
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providing a submount; providing at least one light emitter chip over the submount; exposing a plurality of electrically conductive vias such that portions of the vias are disposed along one external lateral side of the submount for electrically connecting a top contact portion to a bottom contact portion, wherein the top contact portion is external to the submount; and connecting the at least one light emitter chip to the top contact portion by at least one wirebond, wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact, the upper surface of the at least one electrical contact being a surface on which the at least one wirebond is attached thereto. - View Dependent Claims (47, 48, 49, 50)
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51. A light emitter component comprising:
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a submount; a light emitting diode (LED) chip disposed on the submount without any electrically conductive material being disposed between the at least one light emitter chip and the submount; and an electrical contact; wherein the electrical contact wraps around and is in contact with at least three external surfaces of the submount; wherein a first portion of the electrical contact is disposed along a first of the at least three external surfaces, which is orthogonal to a second portion of the electrical contact disposed along a second of the at least three external surfaces; wherein a reflective retention material is disposed over the submount and at least partially disposed over the first portion of the electrical contact for improving light extraction; wherein the first portion of the electrical contacts is entirely external to the submount; and wherein a bottom surface of the at least one light emitter chip is located below an upper surface of the at least one electrical contact. - View Dependent Claims (52, 53)
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Specification