Noise cancellation for a magnetically coupled communication link utilizing a lead frame
First Claim
1. An integrated circuit package, comprising:
- an encapsulation; and
a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising;
a first conductor formed in the lead frame including a first conductive loop and a third conductive loop disposed substantially within the encapsulation; and
a second conductor formed in the lead frame galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors,wherein the third conductive loop is wound in an opposite direction relative to the first conductive loop in the encapsulation;
a transmit circuit disposed within the encapsulation, wherein the transmit circuit is coupled to the second conductor and is coupled to provide a transmitter current; and
a receive circuit disposed within the encapsulation, wherein the receive circuit is coupled to the first conductor and is coupled to receive a transmitter induced signal in response to the transmitter current.
0 Assignments
0 Petitions
Accused Products
Abstract
An integrated circuit package includes a portion of a lead frame disposed within an encapsulation. The lead frame includes a first conductor including a first conductive loop and a third conductive loop disposed substantially within the encapsulation. A second conductor formed in the lead frame is galvanically isolated from the first conductor and includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors. The third conductive loop is wound in an opposite direction relative to the first conductive loop. A transmit circuit is disposed within the encapsulation and is coupled to the second conductor to provide a transmitter current. A receive circuit is disposed within the encapsulation and is coupled to the first conductor to receive a transmitter induced signal in response to the transmitter current.
68 Citations
17 Claims
-
1. An integrated circuit package, comprising:
-
an encapsulation; and a lead frame, a portion of the lead frame disposed within the encapsulation, the lead frame comprising; a first conductor formed in the lead frame including a first conductive loop and a third conductive loop disposed substantially within the encapsulation; and a second conductor formed in the lead frame galvanically isolated from the first conductor, wherein the second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors, wherein the third conductive loop is wound in an opposite direction relative to the first conductive loop in the encapsulation; a transmit circuit disposed within the encapsulation, wherein the transmit circuit is coupled to the second conductor and is coupled to provide a transmitter current; and a receive circuit disposed within the encapsulation, wherein the receive circuit is coupled to the first conductor and is coupled to receive a transmitter induced signal in response to the transmitter current. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
-
Specification