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Sensor and heater for stimulus-initiated fracture of a substrate

  • US 10,224,297 B2
  • Filed: 07/26/2016
  • Issued: 03/05/2019
  • Est. Priority Date: 07/26/2016
  • Status: Active Grant
First Claim
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1. A device, comprising:

  • a stress-engineered substrate;

    a heater thermally coupled to the stress-engineered substrate, the heater comprising a fuse portion;

    a power source; and

    trigger circuitry, comprising;

    a sensor configured to generate a trigger signal when exposed to a trigger stimulus; and

    a switch configured to electrically couple the power source to the heater when activated by the trigger signal, wherein, when electrically coupled to the power source for a predetermined period of time, the fuse portion of the heater is configured to heat up and break, and wherein the stress-engineered substrate is configured to fracture during a cool-down phase after the fuse portion break.

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