×

Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device

  • US 10,224,306 B2
  • Filed: 05/23/2017
  • Issued: 03/05/2019
  • Est. Priority Date: 11/03/2016
  • Status: Active Grant
First Claim
Patent Images

1. An electronic device, comprising:

  • a carrier substrate;

    an electronic chip mounted on the carrier substrate and including a first electrical connection pad and a second electrical connection pad;

    a first electrical connection wire connecting a first electrical connection pad of the carrier substrate and the first electrical connection pad of the electronic chip;

    a second electrical connection wire connecting a second electrical connection pad of the carrier substrate and the second electrical connection pad of the electronic chip;

    a dielectric layer made of a dielectric material on top of a zone of the electronic chip and of the carrier substrate, the dielectric layer covering the first electrical connection wire and the first electrical connection pads but not covering the second electrical connection wire and the second electrical connection pads, such that the dielectric layer forms a local dielectric coating which completely surrounds the first electrical connection wire and completely covers the first electrical connection pads; and

    a local conductive shield made of an electrically conductive material at least partially covering the local dielectric coating and directly contacting the second electrical connection wire and the second electrical connection pads.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×