Integrated system and method of making the integrated system
First Claim
1. A method for manufacturing an integrated device, the method comprising:
- forming a first reconstitution wafer comprising first components;
forming a second reconstitution wafer comprising second components;
dicing the second reconstitution wafer into second packaged components, the second packaged components comprising the second components;
forming a magnetic material between the second packaged components and the first reconstitution wafer after dicing the second reconstitution wafer into second packaged components;
placing the second packaged components on a first main surface of the first reconstitution wafer; and
dicing the first reconstitution wafer into integrated devices, each integrated device comprising a first packaged component and a second packaged component.
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Abstract
A system and method of manufacturing a system are disclosed. An embodiment of the system includes a first packaged component comprising a first component and a first redistribution layer (RDL) disposed on a first main surface of the first packaged component, wherein the first RDL includes first pads. The system further includes a second packaged component having a second component disposed at a first main surface of the second packaged component, the first main surface having second pads and a connection layer between the first packaged component and the second packaged component, wherein the connection layer connects a first plurality of the first pads with the second pads.
111 Citations
14 Claims
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1. A method for manufacturing an integrated device, the method comprising:
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forming a first reconstitution wafer comprising first components; forming a second reconstitution wafer comprising second components; dicing the second reconstitution wafer into second packaged components, the second packaged components comprising the second components; forming a magnetic material between the second packaged components and the first reconstitution wafer after dicing the second reconstitution wafer into second packaged components; placing the second packaged components on a first main surface of the first reconstitution wafer; and dicing the first reconstitution wafer into integrated devices, each integrated device comprising a first packaged component and a second packaged component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for manufacturing an integrated device, the method comprising:
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forming a first reconstitution wafer comprising first components; forming a second reconstitution wafer comprising second components; dicing the second reconstitution wafer into second packaged components, the second packaged components comprising the second components; placing the second packaged components on a first main surface of the first reconstitution wafer; and dicing the first reconstitution wafer into integrated devices, each integrated device comprising a first packaged component and a second packaged component, wherein the second packaged components comprise secondary windings, wherein the first packaged components comprise primary windings, and wherein each integrated device comprises a transformer formed by a primary winding and a secondary winding. - View Dependent Claims (12)
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13. A method for manufacturing an integrated device, the method comprising:
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forming a first reconstitution wafer comprising first components; forming a second reconstitution wafer comprising second components; dicing the second reconstitution wafer into second packaged components, the second packaged components comprising the second components; placing the second packaged components on a first main surface of the first reconstitution wafer; and dicing the first reconstitution wafer into integrated devices, each integrated device comprising a first packaged component and a second packaged component, wherein the second packaged components comprise second portions of primary windings and second portions of secondary windings, wherein the first packaged components comprise first portions of the primary windings and first portions of the secondary windings, and wherein each integrated device comprises a transformer formed by a primary winding and a secondary winding, the primary winding includes a first portion of the primary winding and a second portion of the primary winding and the secondary winding includes a first portion of the secondary winding and a second portion of the secondary winding. - View Dependent Claims (14)
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Specification