Integral optical sensor package

• US 10,224,352 B2
• Filed: 07/17/2012
• Issued: 03/05/2019
• Est. Priority Date: 04/23/2012
• Status: Active Grant

• Current Assignee: Raytron Incorporated
• Original Assignee: Raytron Incorporated
• Inventors: Lee, Hyun Young
• Primary Examiner(s): Luu, Thanh
• Application Number:
  US14/232,782
• Publication Number:
  US 20150034804A1
• Time in Patent Office: 2,422 Days
• Field of Search: 2502082
• CPC Class Codes: G01J 1/0411 using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• CPC Class Codes: G01J 1/4228 arrangements with two or more detectors, e.g. for sensitivity compensation
• CPC Class Codes: G08C 23/04 using light waves, e.g. infrared
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/1443 with at least one potential jump or surface barrier
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 31/02002 Arrangements for conducting electric current to or from the device in operations
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216

Abstract

The present invention relates to an integral optical sensor package. More particularly, the present invention relates to an integral optical sensor package in which a light sensor for receiving a visible light band and a remote control sensor for receiving a light signal of an IR band are integrated such that the two sensors may receive the light of the unique light bands thereof without mutual interference. Further, a light-emitting means for indicating the operation of the remote control sensor can be integrated with the light sensor and the remote control sensor, thus reducing the number of processes and costs for manufacturing an apparatus.

Claims

1. An integrated optical sensor package, comprising:

a housing made of a light-transmitting compound;

a remote control sensor unit to selectively receive only a light signal in an infrared (IR) band from among light signals incident into the housing, convert the received light signal into an electrical signal, and output the electrical signal;

a light emitting unit to indicate that the remote control sensor unit has received the light signal in the IR band, via light emission;

an illuminance sensor coated with a visible light coating agent for transmitting only light in the visible light band; and

a lead frame including one or more mounting parts in which the remote control sensor unit, the illuminance sensor and the light emitting unit are respectively mounted, the lead frame having one or more output terminals for outputting the electrical signal output from the remote control sensor unit to outside of the lead frame,

wherein the remote control sensor unit includes;

a remote control element for receiving light in an IR band, converting the light into an electrical signal, and outputting the electrical signal;

a remote control integrated circuit (IC) for amplifying the electrical signal output from the remote control element;

a first light-shading resin applied to a top surface of the remote control element to selectively transmit only light in the IR band; and

a second light-shading resin applied to a top surface of the remote control integrated circuit to block light incident on the remote control integrated circuit in all bands to prevent noise caused by light incident into the housing.

2. The integrated optical sensor package of claim 1, wherein the remote control sensor unit further includes:

a shield case for sealing tops and opposite sides of the remote control element and the remote control IC, thus eliminating noise.

3. The integrated optical sensor package of claim 1, wherein the light emitting unit indicates reception of a remote control signal via light emission in response to a control signal applied by any one of a control unit of a device, in which the integrated optical sensor package is mounted, and the remote control sensor unit.

4. The integrated optical sensor package of claim 1, wherein the remote control sensor unit further includes a lens formed to protrude upwardly from a top surface of the housing and to transmit light in the IR band.

5. The integrated optical sensor package of claim 1, wherein the integrated optical sensor package is a surface mount device type.