Wiring core structure, semiconductor evaluation device and semiconductor device

• US 10,224,388 B2
• Filed: 05/15/2015
• Issued: 03/05/2019
• Est. Priority Date: 08/25/2014
• Status: Active Grant

• Current Assignee: Mitsubishi Electric Corporation
• Original Assignee: Mitsubishi Electric Corporation
• Inventors: Okada, Akira, Hirao, Masayoshi, Matsuo, Kazushige
• Primary Examiner(s): Patel, Paresh H
• Application Number:
  US14/714,045
• Publication Number:
  US 20160054376A1
• Time in Patent Office: 1,390 Days
• Field of Search: None
• CPC Class Codes: H01F 17/062 Toroidal core with turns of coil around it
• CPC Class Codes: H01F 27/325 Coil bobbins formers for coils in general H01F5/02
• CPC Class Codes: H01F 3/14 Constrictions; Gaps, e.g. air-gaps in magnetic shunt paths H01F3/12
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1203 Rectifying Diode
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]

Abstract

A wound wire is wound around a core assembly so that both ends are short-circuited. In a coupling pin insertion state in which a coupling pin is inserted in a through hole of the core assembly, outer-peripheral space parts of respective divided core portions of the core assembly are disposed so as to overlap in plan view. Consequently, an air gap is formed in a part of a side surface of the core assembly. Before formation of a covering member, a main wire is caused to pass through the air gap and is thus disposed in a wiring hole of the core assembly. Then, the covering member for closing the air gap is provided on an outer peripheral surface side of the core assembly including the air gap so that a core structure is obtained.

Claims

1. A wiring core structure comprising:

a tubular-shaped core portion having a wiring hole for passage of a main wire to be a parasitic-inductance suppression target and having a body portion made of a soft magnetic material; and

a wound wire formed by winding a wire around said core portion and having both ends short-circuited, wherein

said core portion includes a plurality of divided core portions which are disposed in a superposed relation and each have a wiring hole, and

said plurality of divided core portions are formed such that shapes of said wiring holes and outside diameters of said body portions are different from each other and said wound wire is separately wound about all exterior surfaces of each divided core portion, thereby implementing a superposition structure without overlapping in plan view.

2. A semiconductor evaluation device having a measuring function for connecting a measurement target element to measure a characteristic of said measurement target element, said device comprising:

a power supply;

an L load portion; and

the wiring core structure according to claim 1, wherein

said wiring core structure is provided by setting, as a main wire, at least one of a plurality of wiring portions including between said power supply and said L load portion, between said L load portion and said measurement target element, and between said power supply and said measurement target element.

3. A semiconductor device comprising:

a plurality of elements; and

the wiring core structure according to claim 1, wherein

said wiring core structure is provided by setting, as a main wire, at least one of said plurality of wiring portions between said plurality of elements.