Micro assembled LED displays and lighting elements

• US 10,224,460 B2
• Filed: 06/18/2015
• Issued: 03/05/2019
• Est. Priority Date: 06/18/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher, Meitl, Matthew, Gomez, David, Bonafede, Salvatore, Kneeburg, David, Fecioru, Alin, Prevatte, Carl
• Primary Examiner(s): Oh, Jaehwan
• Assistant Examiner(s): Parker, John M
• Application Number:
  US14/743,788
• Publication Number:
  US 20160018094A1
• Time in Patent Office: 1,356 Days
• CPC Class Codes: F21V 9/08 for producing coloured light, e.g. monochromatic; for reducing intensity of light with provision for controlling the colour F21V9/40
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 26/04 by periodically varying the intensity of light, e.g. using choppers shutters, diaphragms for cameras G03B9/00; devices for eliminating or reducing the effect of flicker in projection systems G03B21/40
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G09G 2300/0452 Details of colour pixel setup, e.g. pixel composed of a red, a blue and two green components
• CPC Class Codes: G09G 2300/0842 forming a memory circuit, e.g. a dynamic memory with one capacitor
• CPC Class Codes: G09G 2310/0264 Details of driving circuits
• CPC Class Codes: G09G 3/22 using controlled light sources
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/4821 Bridge structure with air gap
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 : characterised by the electrodes
• CPC Class Codes: H01L 33/38 : with a particular shape
• CPC Class Codes: H01L 33/385 : the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/48 : characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/50 : Wavelength conversion elements
• CPC Class Codes: H01L 33/502 : Wavelength conversion materials
• CPC Class Codes: H01L 33/508 : having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/58 : Optical field-shaping elements
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0329 : Intrinsically conductive polymer [ICP]; Semiconductive polymer
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 : Display
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 5/0017 : with operator interface units

Abstract

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

Claims

1. A micro-assembled device, comprising:

a device substrate having a surface;

a first electrical conductor disposed on the surface of the device substrate;

a second electrical conductor disposed on the surface of the device substrate; and

a conductive juniper element distinct and separate from the device substrate comprising one or more jumper conductors,

wherein the conductive jumper element is disposed on the surface of the device substrate with a first jumper conductor of the one or more jumper conductors in direct electrical contact with both the first electrical conductor and the second electrical conductor,

wherein the conductive jumper element comprises a jumper substrate, a portion of the conductive jumper element is recessed, and only a portion and less than all of the recess comprises an insulator,

wherein the conductive jumper element is housed within a structure suitable for micro transfer printing, and

wherein the conductive jumper element is exposed and the recess is disposed on a side of the conductive jumper element adjacent to the surface of the device substrate.

2. The device of claim 1, wherein the conductive jumper element is a conductive passive device.

3. The device of claim 1, wherein the conductive jumper element is an active device.

4. The device of claim 3, wherein the active device is a CMOS device.

5. The device of claim 3, wherein the active device comprises at least one of drive circuitry and non-volatile memory.

6. The device of claim 1, wherein the conductive jumper element comprises one or more members selected from the group consisting of a semiconductor, silicon, silicon on insulator, a glass, a metal, and a dielectric.

7. The device of claim 1, wherein the jumper conductor comprises one or more members selected from the group consisting of a semiconductor, a metal, a noble metal, gold, silver, platinum, copper, stainless steel, nickel, chromium, solder, PbSn, and AgSn.

8. The device of claim 1, comprising a third electrical conductor on the device substrate that is electrically isolated from the first electrical conductor and the second electrical conductor, wherein the third electrical conductor is located under the recess of the conductive jumper element.

9. The device of claim 1, wherein the insulator is an exposed insulator.

10. The device of any one of claims 1 to 7, wherein the conductive jumper element comprises a first terminal electrically connected to a second terminal with an exposed insulator therebetween, wherein the first terminal, second terminal, and the exposed insulator form a planar surface on at least one side of the conductive jumper element.

11. The device of claim 1, wherein a central portion of at least one of the jumper conductors is covered with an insulator separating exposed ends of the jumper conductor.

12. The device of claim 1, wherein the device substrate is a display substrate and the conductive jumper element electrically connects a redundant light emitter to a display circuit.

13. The device of claim 1, wherein a distance between the first electrical conductor and the second electrical conductor is from 100 nm to 500 nm, 500 nm to 1 micron, 1 micron to 20 microns, 20 microns to 50 microns, or 50 microns to 100 microns.

14. The device of claim 1, wherein the device substrate has a thickness from 5 to 10 microns, 10 to 50 microns, 50 to 100 microns, 100 to 200 microns, 200 to 500 microns, 500 microns to 0.5 mm, 0.5 to 1 mm, 1 mm to 5 mm, 5 mm to 10 mm, or 10 mm to 20 mm.

15. The device of claim 1, wherein conductive jumper element has at least one of a width, length, and height from 2 to 5 μ

m, 5 to 10μ

m, 10 to 20 μ

m, or 20 to 50 μ

m.

16. The device of claim 1, comprising:

a plurality of first electrical conductors disposed on the device substrate, wherein the plurality of first electrical conductors comprises the first electrical conductor;

a plurality of second electrical conductors disposed on the device substrate, wherein the plurality of second electrical conductors comprises the second electrical conductor,

wherein the conductive jumper element comprises a plurality of jumper conductors, wherein the plurality of jumper conductors comprises the one or more jumper conductors,

wherein each jumper conductor of the plurality of jumper conductors is in electrical contact with both a first electrical conductor of the plurality of electrical conductors and a second electrical conductor of the plurality of second electrical conductors.