Light emitting device with wavelength converting side coat
First Claim
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1. A light-emitting device comprising:
- a light-emitting semiconductor structure having a first surface, a second surface opposite the first surface, and a plurality of sides surfaces;
a plurality of contacts disposed in contact with the first surface of the light-emitting semiconductor structure;
a wavelength converting tile having a first surface, a second surface opposite the first surface, and a plurality of side surfaces, the wavelength converting tile being disposed on the light-emitting semiconductor structure such that the second surface of the wavelength converting tile is adjacent the second surface of the light-emitting semiconductor structure, the wavelength converting tile comprising a first wavelength converting material; and
a sheet of a second wavelength converting material that is laminated on one or more of the plurality of side surfaces of the light-emitting semiconductor structure and one or more of the plurality of side surfaces of the wavelength converting tile, the sheet of the second wavelength converting material being arranged to cover at least a portion of the one or more of the plurality of side surfaces of the wavelength converting tile, while leaving the first surface of the wavelength converting tile uncovered.
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Abstract
Embodiments of the invention include a semiconductor light emitting device, a first wavelength converting member disposed on a top surface of the semiconductor light emitting device, and a second wavelength converting member disposed on a side surface of the semiconductor light emitting device. The first and second wavelength converting members include different wavelength converting materials.
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Citations
19 Claims
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1. A light-emitting device comprising:
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a light-emitting semiconductor structure having a first surface, a second surface opposite the first surface, and a plurality of sides surfaces; a plurality of contacts disposed in contact with the first surface of the light-emitting semiconductor structure; a wavelength converting tile having a first surface, a second surface opposite the first surface, and a plurality of side surfaces, the wavelength converting tile being disposed on the light-emitting semiconductor structure such that the second surface of the wavelength converting tile is adjacent the second surface of the light-emitting semiconductor structure, the wavelength converting tile comprising a first wavelength converting material; and a sheet of a second wavelength converting material that is laminated on one or more of the plurality of side surfaces of the light-emitting semiconductor structure and one or more of the plurality of side surfaces of the wavelength converting tile, the sheet of the second wavelength converting material being arranged to cover at least a portion of the one or more of the plurality of side surfaces of the wavelength converting tile, while leaving the first surface of the wavelength converting tile uncovered. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A light-emitting device comprising:
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a light-emitting semiconductor structure having a first surface, a second surface opposite the first surface, a plurality of side surfaces, and a first thickness; a plurality of contacts disposed in contact with the first surface of the light-emitting semiconductor structure; a wavelength converting tile having a first surface, a second surface opposite the first surface, and a plurality of side surfaces, the wavelength converting tile being disposed on the light-emitting semiconductor structure such that the second surface of the wavelength converting tile is adjacent the second surface of the light-emitting semiconductor structure, the wavelength converting tile including a first substrate, a second substrate, and a layer of a first wavelength converting material disposed between the first substrate and the second substrate, the wavelength converting tile having a second thickness that is greater than the first thickness; and a sheet of wavelength converting material that is laminated on one or more of the plurality of side surfaces of the wavelength converting tile, the sheet of wavelength converting material being arranged to cover at least a portion of the plurality of side surfaces of the wavelength converting tile, while leaving the first surface of the wavelength converting tile uncovered. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for manufacturing a light-emitting device, comprising:
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forming a light-emitting semiconductor structure having a first surface, a second surface opposite the first surface, a plurality of side surfaces, and a first thickness; forming a plurality of contacts in contact with the first surface of the light-emitting semiconductor structure; disposing a prefabricated wavelength converting tile on the second surface of the light-emitting semiconductor structure, the prefabricated wavelength converting tile having a first surface, a second surface opposite the first surface, a plurality of side surfaces, and a second thickness that is greater than the first thickness, the second surface of the prefabricated wavelength converting tile being disposed adjacent the second surface of the light-emitting semiconductor structure; and after disposing the prefabricated wavelength converting tile on the second surface of the light-emitting semiconductor structure, laminating a preformed sheet of wavelength converting material on one or more of the plurality of side surfaces of the prefabricated wavelength converting tile, the sheet of wavelength converting material being arranged to cover at least a portion of the one or more of the plurality of side surfaces of the pre-fabricated wavelength converting tile, while leaving the first surface of the tile uncovered. - View Dependent Claims (16, 17, 18, 19)
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Specification