Ceramic circuit board and electronic device
First Claim
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1. A ceramic circuit board comprising:
- an insulating substrate comprising stacked insulating layers of an alumina-based sintered body;
internal leads comprising Cu and W embedded in the insulating substrate;
one or a plurality of metal layers comprising Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to a surface of the insulating substrate in a stacking direction which is orthogonal to the surface of the insulating substrate; and
a through conductor connected to the at least one metal layer, the through conductor being embedded in the insulating substrate and passing through the insulating layers in the stacking direction,wherein at least part of the at least one metal layer overlaps the internal leads in a plan view, and the internal leads are not connected to the metal layer and the through conductor.
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Abstract
A ceramic circuit board includes an insulating substrate composed of stacked insulating layers of an alumina-based sintered body, internal leads containing Cu embedded in the insulating substrate, and one or a plurality of metal layers containing Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction, wherein at least part of the metal layer overlaps the internal leads in plan view.
8 Citations
12 Claims
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1. A ceramic circuit board comprising:
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an insulating substrate comprising stacked insulating layers of an alumina-based sintered body; internal leads comprising Cu and W embedded in the insulating substrate; one or a plurality of metal layers comprising Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to a surface of the insulating substrate in a stacking direction which is orthogonal to the surface of the insulating substrate; and a through conductor connected to the at least one metal layer, the through conductor being embedded in the insulating substrate and passing through the insulating layers in the stacking direction, wherein at least part of the at least one metal layer overlaps the internal leads in a plan view, and the internal leads are not connected to the metal layer and the through conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification