Method of producing suspension board with circuit
First Claim
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1. A method of producing a suspension board with circuit, comprising the steps of:
- preparing a metal supporting layer;
forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer;
curing the curable insulating layer to form an insulating layer;
subjecting the metal supporting layer exposed from the opening to microwave plasma treatment having a frequency in a range of 1.0 GHz to 10 GHz, thereby to remove foreign material which is a component derived from the curable insulating layer and is deposited on the metal supporting layer exposed from the opening; and
forming a metal conducting portion on the metal supporting layer exposed from the opening.
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Abstract
A method of producing a suspension board with circuit includes the steps of preparing a metal supporting layer, forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer, curing the curable insulating layer to form an insulating layer, subjecting the metal supporting layer exposed from the opening to microwave plasma treatment, and forming a metal conducting portion on the metal supporting layer exposed from the opening.
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Citations
5 Claims
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1. A method of producing a suspension board with circuit, comprising the steps of:
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preparing a metal supporting layer; forming a curable insulating layer on the metal supporting layer using a photosensitive curable insulating composition such that an opening is formed in the curable insulating layer; curing the curable insulating layer to form an insulating layer; subjecting the metal supporting layer exposed from the opening to microwave plasma treatment having a frequency in a range of 1.0 GHz to 10 GHz, thereby to remove foreign material which is a component derived from the curable insulating layer and is deposited on the metal supporting layer exposed from the opening; and forming a metal conducting portion on the metal supporting layer exposed from the opening. - View Dependent Claims (2, 3, 4, 5)
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Specification