System and method for cooling power electronics

• US 10,225,961 B2
• Filed: 11/18/2015
• Issued: 03/05/2019
• Est. Priority Date: 11/18/2014
• Status: Active Grant

• Current Assignee: GE Global Sourcing LLC (Westinghouse Air Brake Technologies Corporation)
• Original Assignee: GE Global Sourcing LLC (Westinghouse Air Brake Technologies Corporation)
• Inventors: Young, Henry Todd, Cillessen, Sean Patrick
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US15/517,195
• Publication Number:
  US 20170311490A1
• Time in Patent Office: 1,203 Days
• Field of Search: 361699
• CPC Class Codes: H05K 7/20263 Heat dissipaters releasing heat from coolant
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A cooling system for power electronics of an engine-powered unit includes at least one power electronics component, a liquid chamber in thermal communication with a frame of the engine-powered unit, and a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber. The liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame to cool the cooling fluid.

Claims

1. A cooling system for power electronics, comprising:

at least one power electronics component;

a liquid chamber in thermal communication with a frame of an engine-powered unit; and

a pump configured to circulate a cooling fluid through the at least one power electronics component and the liquid chamber;

wherein the liquid chamber is configured to conductively transfer heat from the cooling fluid to the frame;

wherein the engine-powered unit is a haul truck and the frame is a metal dump body of the haul truck; and

wherein the metal dump body comprises a unitary metal piece having a mass of at least 1300 kg, and wherein the metal dump body includes a channel completely enclosed by the metal dump body, the channel defining the liquid chamber, and further comprising one or more flexible couplers fluidly coupling the channel to the pump and the at least one power electronic component, the at least one power electronic component located on the haul truck but off the metal dump body.

2. A method for cooling power electronics of an engine-powered unit, the method comprising the steps of:

circulating a cooling fluid through a power electronics cooling loop to remove heat from the power electronics; and

cooling the fluid by transferring heat from the fluid to a frame of the engine-powered unit;

wherein the engine-powered unit is a haul truck and the frame is a metal dump body of the haul truck; and

wherein the metal dump body comprises a unitary metal piece having a mass of at least 1300 kg, and wherein the metal dump body includes a channel completely enclosed by the metal dump body, the channel receiving the cooling fluid, and wherein circulating the cooling fluid comprises routing the cooling fluid through one or more flexible couplers fluidly coupling the channel to a pump and the power electronics, the power electronics located on the haul truck but off the metal dump body.

3. The method according to claim 2, further comprising the step of:

cooling the frame by transferring heat from the frame to atmosphere.

4. A cooling system for power electronics, comprising:

a power electronics cooling loop having a first fluid configured for circulation through at least one power electronics component of a haul truck;

a heat rejection loop having a second fluid configured for circulation through a liquid chamber, the liquid chamber being in thermal communication with a metal dump body of the haul truck, wherein the metal dump body comprises a unitary metal piece having a mass of at least 1300 kg, and wherein the metal dump body includes a channel completely enclosed by the metal dump body, the channel defining the liquid chamber, wherein the power electronics cooling loop is fluidly isolated from, and in thermal communication with, the heat rejection loop, and wherein the liquid chamber is configured to conductively transfer heat from the second fluid to the metal dump body;

a first pump configured to circulate the first fluid through the at least one power electronics component and the power electronics cooling loop;

a second pump configured to circulate the second fluid through the liquid chamber and the heat rejection loop;

one or more flexible couplers fluidly coupling the channel to the second pump, the at least one power electronic component and the second pump located on the haul truck but off the metal dump body; and

a heat exchanger coupled to the first pump and the second pump and configured for the exchange of heat from the first fluid to the second fluid.