Pressure sensing implant

• US 10,226,218 B2
• Filed: 03/17/2014
• Issued: 03/12/2019
• Est. Priority Date: 06/30/2011
• Status: Active Grant

• Current Assignee: Endotronix, Inc.
• Original Assignee: Endotronix, Inc.
• Inventors: Rowland, Harry, Nagy, Michael, Sundaram, Balamurugan, Sundaram, Suresh
• Primary Examiner(s): Bloch, Michael R
• Application Number:
  US14/777,654
• Publication Number:
  US 20160029956A1
• Time in Patent Office: 1,821 Days
• Field of Search: None
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/168 Fluid filled sensor housings
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/686 Permanently implanted devices, e.g. pacemakers, other stimulators, biochips A61B5/6861 takes precedence
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 3/0035 Constitution or structural means for controlling the movement of the flexible or deformable elements
• CPC Class Codes: B81C 1/00261 Processes for packaging MEMS devices MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/075 the electronic processing unit being integrated into an element of the micromechanical structure
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields

Abstract

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

Claims

1. A circuit comprising:

a housing having a plurality of walls that defines a cavity and an opening;

a sensor connected to said opening in said housing, said sensor comprising;

a lid wafer including at least one electrode and having a first dimension;

a base wafer including at least one electrode and being bonded to said lid wafer, said base wafer having a second dimension shorter than said first dimension; and

wherein said base wafer is positioned entirely within said cavity defined by said housing and a surface of said lid wafer is exposed to an exterior of said housing.

2. The circuit of claim 1, wherein said sensor is a pressure sensor.

3. The circuit of claim 2, wherein said pressure sensor is a capacitive pressure sensor.

4. The circuit of claim 1, wherein said sensor is connected to said opening to hermetically seal said housing.

5. The circuit of claim 1, wherein a second surface of said lid wafer is accessible from inside said housing.

6. The circuit of claim 1, wherein said lid wafer, said base wafer, and said housing are comprised of any combination of glass, silicon, or ceramic.

7. The circuit of claim 1, wherein an antenna is located within said housing.

8. The circuit of claim 7, wherein an antenna axis is substantially parallel to at least one wall of said housing.

9. The circuit of claim 1, wherein said circuit is configured to be implanted in a blood vessel.

10. The circuit of claim 1, wherein said housing is filled with a substance selected from a group including:

liquid, gel, vacuum, inert gas, or air.

11. The circuit of claim 1, wherein the sensor is a capacitive pressure sensor wherein a second surface of said lid wafer is bonded to a first surface of said base wafer.

12. The circuit of claim 11, further comprising at least one electrical contact on said second surface of said lid wafer.

13. The circuit of claim 12, further comprising at least one electrical contact on said first surface of said base wafer wherein the at least one electrical contact on said second surface of said lid wafer and said at least one electrical contacts on said first surface of said base wafer are contained within a bondline.

14. A circuit comprising:

a housing having a plurality of walls that defines a cavity and an opening;

a sensor connected to said opening to form a hermetic seal in said housing, said sensor comprising;

a lid wafer having a first dimension, a first surface, and a second surface wherein said first surface is exposed to an exterior of said housing, at least one electrode positioned on said second surface of said lid wafer;

a base wafer having a first surface bonded to said second surface of said lid wafer and having a second dimension shorter than said first dimension, at least one electrode positioned on said first surface of said base wafer; and

wherein said at least one electrode on said second surface of said lid wafer and said at least one electrode on said first surface of said base wafer are contained within a bondline defined between the base wafer and the lid wafer; and

wherein said base wafer is positioned entirely within said cavity defined by said housing.

15. The circuit of claim 14 further comprising a cavity between the lid wafer and base wafer.