Microelectromechanical system (MEMS) device packaging

• US 10,227,232 B2
• Filed: 07/26/2017
• Issued: 03/12/2019
• Est. Priority Date: 07/27/2016
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Lim, Tony K., Talag, Norman D.
• Primary Examiner(s): Laekemariam, Yosef K
• Application Number:
  US15/660,543
• Publication Number:
  US 20180029880A1
• Time in Patent Office: 594 Days
• Field of Search: 381122, 381174, 381 91, 381357, 381175, 381176, 381372, 381 92, 381112, 381113, 381114
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/016 for microphones
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003

Abstract

Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The substrate defines a port. The cap is coupled to the substrate. The substrate and the cap cooperatively define an interior cavity. The microelectromechanical component is disposed within the interior cavity and coupled to the substrate such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity. The tag is coupled to the substrate and the cap. The tag is positioned to secure the cap to the substrate.

Claims

1. A microelectromechanical system (MEMS) device, comprising:

a substrate defining a port;

a cap coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity;

a microelectromechanical component disposed within the interior cavity and coupled to the substrate such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity; and

a non-continuous tag coupled to the substrate and the cap, wherein the non-continuous tag is positioned at one or more discrete locations along a periphery of the cap to secure the cap to the substrate.

2. The MEMS device of claim 1, further comprising a guard ring coupled between the substrate and the cap.

3. The MEMS device of claim 2, wherein the guard ring defines at least one of an aperture or a semi-cutout.

4. The MEMS device of claim 3, wherein the guard ring defines the aperture, and wherein the non-continuous tag is positioned to seal the aperture of the guard ring.

5. The MEMS device of claim 4, wherein the microelectromechanical component includes a non-pierced microphone.

6. The MEMS device of claim 3, wherein the guard ring defines the semi-cutout, and wherein the non-continuous tag is positioned to latch onto the semi-cutout to secure the cap to the substrate.

7. The MEMS device of claim 6, wherein the microelectromechanical component includes a pierced microphone.

8. The MEMS device of claim 3, further comprising a second non-continuous tag coupled on a side of the guard ring opposite the at least one of the aperture or the semi-cutout, the second non-continuous tag further securing the cap to the substrate.

9. The MEMS device of claim 2, wherein at least one of (i) the guard ring is coupled to the substrate with solder or (ii) the cap is coupled to the guard ring with solder.

10. The MEMS device of claim 9, wherein a material of the non-continuous tag has a higher melting point than the solder thereby inhibiting movement of the cap during a reflow process.

11. A method of manufacturing a microelectromechanical system (MEMS) device, comprising:

providing a substrate blank defining a plurality of apertures;

coupling a plurality of guard rings to the substrate blank such that each of the plurality of guard rings is positioned to surround a respective one of the plurality of apertures, wherein each of the plurality of guard rings defines at least one of a vent or a semi-cutout;

coupling a plurality of microelectromechanical components to the substrate blank, each of the plurality of microelectromechanical components positioned within a periphery of a respective guard ring and at least partially isolating a respective one of the plurality of apertures;

coupling a plurality of caps onto the plurality of guard rings, each of the plurality of caps coupled to a respective one of the plurality of guard rings;

applying a plurality of tags to seal each vent or semi-cutout and secure each set of guard rings and caps to the substrate blank; and

singulating each set of guard rings and caps from the substrate blank to form a plurality of individual MEMS devices.

12. The method of claim 11, wherein each of the plurality of guard rings includes a first edge and an opposing second edge, the at least one of the vent or the semi-cutout defined by the second edge, and wherein applying the plurality of tags includes applying each of the plurality of tags between the first edge of a first guard ring and the second edge of a second, adjacent guard ring such that the first edge of the first guard ring and the second edge of the second, adjacent guard ring are coupled to the substrate blank by a single tag.

13. The method of claim 11, wherein at least one of (i) the plurality of guard rings are coupled to the substrate blank with solder or (ii) the plurality of caps are coupled to the plurality of guard rings with solder.

14. The method of claim 13, wherein the plurality of tags include a material having a higher melting point than the solder.

15. The method of claim 11, wherein at least one of coupling the plurality of guard rings to the substrate blank, coupling the plurality of microelectromechanical components to the substrate blank, or coupling the plurality of caps onto the plurality of guard rings increases a pressure within an interior cavity of each of the plurality of individual MEMS devices, and wherein the vent is positioned to relieve the pressure within the interior cavity prior to the plurality of tags being applied.

16. A populated printed-circuit-board (PCB) blank, comprising:

a substrate blank defining a plurality of substrate apertures;

a plurality of microelectromechanical devices positioned on the substrate blank, each of the plurality of microelectromechanical devices including;

a guard ring coupled to the substrate blank, the guard ring having a first edge and an opposing second edge defining at least one of a vent aperture or a semi-cutout;

a lid coupled to the guard ring, wherein the substrate blank, the guard ring, and the lid cooperatively define an interior cavity; and

a microelectromechanical component coupled to the substrate blank over a respective substrate aperture to at least partially isolate the respective substrate aperture from the interior cavity; and

a plurality of tags, each of the plurality of tags positioned between adjacent microelectromechanical devices such that (i) the first edge and the second edge of each guard ring are secured to the substrate blank (ii) and each of the at least one of the vent aperture or the semi-cutout is sealed.

17. The populated PCB blank of claim 16, wherein one of the plurality of tags is positioned between each pair of adjacent microelectromechanical devices.

18. The populated PCB blank of claim 16, wherein each of the plurality of tags includes a non-meltable material.

19. The populated PCB blank of claim 16, wherein each of the plurality of microelectromechanical components includes a microphone.

20. The populated PCB blank of claim 16, wherein each of the plurality of tags inhibits each lid from moving.