LED light bulb and LED filament thereof

• US 10,228,093 B2
• Filed: 08/16/2016
• Issued: 03/12/2019
• Est. Priority Date: 08/17/2015
• Status: Active Grant

• Current Assignee: Jiaxing Super Lighting Electric Appliance Co., Ltd.
• Original Assignee: Jiaxing Super Lighting Electric Appliance Co., Ltd.
• Inventors: Jiang, Tao, Li, Li-Qin
• Primary Examiner(s): Gramling, Sean P
• Application Number:
  US15/237,983
• Publication Number:
  US 20170051878A1
• Time in Patent Office: 938 Days
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/061 the material being glass
• CPC Class Codes: F21V 3/062 the material being plastics
• CPC Class Codes: F21Y 2103/33 annular
• CPC Class Codes: F21Y 2103/37 U-shaped
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED filament and an LED light bulb applying the same are disclosed. The LED filament includes LED chips, conductive electrodes disposed corresponding to the LED chips, and a light conversion coating. The LED chips are electrically connected together and the conductive electrodes are electrically connected with the LED chips. The light conversion coating includes an adhesive and a plurality of phosphors. The light conversion coating coats on at least two sides of the LED chips and the conductive electrodes. The light conversion coating exposes a portion of two of the conductive electrodes. Accordingly, the LED filament is capable of emitting light similar to that a point light source does and the LED light bulb may emit omnidirectional light.

Claims

1. An LED light bulb, comprising:

a bulb shell;

a bulb base connected with the bulb shell; and

an LED filament disposed in the bulb shell, the LED filament comprising;

a plurality of LED chips, electrically connected together;

two conductive electrodes, disposed corresponding to the plurality of LED chips, the conductive electrodes being electrically connected with the plurality of LED chips; and

a flexible light conversion coating, coating on each side of the LED chips and a portion of the conductive electrodes, and exposing a portion of the conductive electrodes, and the flexible light conversion coating comprising an adhesive and a plurality of particles,

wherein the plurality of particles comprises phosphors and nanoparticles and a percentage of the particles in the flexible light conversion coating is greater than a percentage of the adhesive in the flexible light conversion coating,

wherein the flexible light conversion coating further comprises at least one thermal conduction path formed by at least a part of the phosphors and nanoparticles which are adjacent to and contact one another, the at least one thermal conduction path has an internal end and an external end, the internal end of the at least one thermal conduction path contacts one of the LED chips, and the external end of the at least one thermal conduction path contacts the surface of the flexible light conversion coating away from the LED chips and is exposed from the surface of the flexible light conversion coating.

2. The LED light bulb of claim 1, wherein the LED filament further comprises a plurality of conductive wires electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, the flexible light conversion coating covering the plurality of conductive wires.

3. The LED light bulb of claim 2, wherein at least one of the plurality of conductive wires is of M shape.

4. The LED light bulb of claim 1, wherein the LED filament further comprises a plurality of circuit films electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, wherein the flexible light conversion coating covering the plurality of the circuit films.

5. The LED light bulb of claim 4, wherein each of the circuit films comprises a first film and a conductive circuit disposed thereon, and the conductive circuits are electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes.

6. The LED light bulb of claim 1, wherein the flexible light conversion coating comprises a base layer and a top layer, the plurality of LED chips are on a side of the base layer.

7. The LED light bulb of claim 6, wherein the hardness of the base layer is higher than the hardness of the top layer.

8. The LED light bulb of claim 1, wherein the LED filament further comprises a plurality of conductive wires electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, the flexible light conversion coating covering the plurality of conductive wires and each side of each of the plurality of LED chips, at least one of the plurality of conductive wires being of M shape, wherein the flexible light conversion coating comprises a base layer and a top layer, the plurality of LED chips are on a side of the base layer, the hardness of the base layer is higher than the hardness of the top layer, a size of the nanoparticles is substantially smaller than a size of the phosphors, the composition ratio of the plurality of the phosphors to the adhesive is between 1.5:

1 or 50;

1.

9. The LED light bulb of claim 1, wherein the LED filament further comprises a plurality of circuit films electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, the flexible light conversion coating covering the plurality of the circuit films, each of the circuit films comprising a first film and a conductive circuit disposed thereon, and the conductive circuits electrically and correspondingly connected among the plurality of LED chips and the conductive electrodes, wherein the flexible light conversion coating comprises a base layer and a top layer, the plurality of LED chips are on a side of the base layer, the hardness of the base layer is higher than the hardness of the top layer, a size of the nanoparticles is substantially smaller than a size of the phosphors, the composition ratio of the plurality of the phosphors to the adhesive is between 1.5:

1 or 50;

1.

10. The LED light bulb of claim 1, wherein the percentage of the particles in the flexible light conversion coating is a volume percentage or a weight percentage and the percentage of the adhesive in the flexible light conversion coating is a volume percentage or a weight percentage.

11. The LED light bulb of claim 1, wherein the size of the nanoparticles is substantially smaller than the size of the phosphors.

12. The LED light bulb of claim 11, wherein the thermal conduction path formed by at least a part of the phosphors and the nanoparticles which are adjacent to and contact one another.

13. The LED light bulb of claim 1, wherein the flexible light conversion coating further comprises at least two of the thermal conduction paths, the external end of one of the at least two thermal conduction paths contacts a first surface of the flexible light conversion coating away from the LED chips and is exposed from the first surface of the flexible light conversion coating, the external end of another one of the at least two thermal conduction paths contacts a second surface of the flexible light conversion coating away from the LED chips and is exposed from the second surface of the flexible light conversion coating, the first surface and the second surface are opposite to each other, and one of first surface and the second surface is an illumination surface of the LED filament.

14. An LED light bulb, comprising:

a bulb shell;

a bulb base connected with the bulb shell; and

an LED filament disposed in the bulb shell, the LED filament comprising;

a plurality of LED chips, electrically connected together;

two conductive electrodes, disposed corresponding to the plurality of LED chips, the conductive electrodes being electrically connected with the plurality of LED chips; and

a flexible light conversion coating comprising a top layer and a base layer, the flexible light conversion coating coating on each side of the LED chips and a portion of the conductive electrodes, and exposing a portion of the conductive electrodes, the LED chips interposed between the base layer and the top layer,

wherein the top layer comprises a first adhesive and a plurality of first particles and the base layer comprises a second adhesive and a plurality of second particles, the plurality of first particles at least comprises phosphors and a percentage of the plurality of first particles in the top layer is greater than a percentage of the first adhesive in the top layer,

wherein the flexible light conversion coating further comprises at least one thermal conduction path formed by at least a part of the first or second particles which are adjacent to and contact one another, the at least one thermal conduction path has an internal end and an external end, the internal end of the at least one thermal conduction path contacts one of the LED chips, and the external end of the at least one thermal conduction path contacts the surface of the flexible light conversion coating away from the LED chips and is exposed from the surface of the flexible light conversion coating.

15. The LED light bulb of claim 14, wherein the percentage of the plurality of first particles in the top layer is a volume percentage or a weight percentage and the percentage of the first adhesive in the top layer is a volume percentage or a weight percentage.

16. The LED light bulb of claim 15, wherein the plurality of first particles further comprises first nanoparticles, and the size of the first nanoparticles is substantially smaller than the size of the first phosphors.

17. The LED light bulb of claim 14, wherein the percentage of the plurality of second particles in the base layer is a volume percentage or a weight percentage and the percentage of the second adhesive in the base layer is a volume percentage or a weight percentage.

18. The LED light bulb of claim 17, wherein the plurality of second particles further comprises second nanoparticles, and the size of the second nanoparticles is substantially smaller than the size of the second phosphors.

19. The LED light bulb of claim 14, wherein the plurality of second particles at least comprises phosphors and a percentage of the plurality of second particles in the base layer is greater than a percentage of the second adhesive in the base layer.

20. The LED light bulb of claim 19, wherein the flexible light conversion coating further comprises at least two of the thermal conduction paths comprising a first thermal conduction path formed by at least a part of the first particles which are adjacent to and contact one another and a second thermal conduction path formed by at least a part of the second particles which are adjacent to and contact one another, the external end of the first thermal conduction path contacts a first surface of the flexible light conversion coating away from the LED chips and is exposed from the first surface of the flexible light conversion coating, the external end of the second thermal conduction path contacts a second surface of the flexible light conversion coating away from the LED chips and is exposed from the second surface of the flexible light conversion coating, the first surface and the second surface are opposite to each other, and one of first surface and the second surface is an illumination surface of the LED filament.