Input device configuration having capacitive and pressure sensors
First Claim
1. An input device comprising:
- a capacitive sensor assembly including a plurality of capacitive sensors disposed on one or more first portions of a sensor substrate, the capacitive sensors configured to detect an object as proximal to a respective capacitive sensor of the capacitive sensor assembly; and
a pressure sensitive sensor assembly including a plurality of pressure sensitive sensor nodes disposed on one or more second portions of the sensor substrate, the one or more second portions comprising one or more non-overlapping portions of the sensor substrate that are separate from the one or more first portions, the pressure sensitive sensor nodes configured to detect an amount of pressure applied to a respective pressure sensitive sensor node of the pressure sensitive sensor assembly;
wherein the capacitive sensor assembly and the pressure sensitive sensor assembly are configured as a single layer on the sensor substrate.
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Accused Products
Abstract
Input device configurations are described. In one or more implementations, an input device includes a sensor substrate having one or more conductors and a flexible contact layer spaced apart from the sensor substrate. The flexible contact layer is configured to flex to contact the sensor substrate to initiate an input of a computing device. In one or more implementations, an input device includes a capacitive sensor assembly arranged in an array that is configured to detect a location of an object that is proximal to a respective capacitive sensor of the capacitive sensor assembly and a pressure sensitive sensor assembly including a plurality of pressure sensitive sensor nodes that are configured to detect an amount of pressure applied by the object against a respective pressure sensitive sensor node of the pressure sensitive sensor assembly.
626 Citations
16 Claims
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1. An input device comprising:
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a capacitive sensor assembly including a plurality of capacitive sensors disposed on one or more first portions of a sensor substrate, the capacitive sensors configured to detect an object as proximal to a respective capacitive sensor of the capacitive sensor assembly; and a pressure sensitive sensor assembly including a plurality of pressure sensitive sensor nodes disposed on one or more second portions of the sensor substrate, the one or more second portions comprising one or more non-overlapping portions of the sensor substrate that are separate from the one or more first portions, the pressure sensitive sensor nodes configured to detect an amount of pressure applied to a respective pressure sensitive sensor node of the pressure sensitive sensor assembly; wherein the capacitive sensor assembly and the pressure sensitive sensor assembly are configured as a single layer on the sensor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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detecting that an object is located as proximal to one or more capacitive sensors disposed on one or more first portions of a sensor substrate of an input device; detecting pressure applied to one or more pressure sensitive sensor nodes disposed on one or more second portions of the sensor substrate, the one or more second portions comprising one or more non-overlapping portions of the sensor substrate of the input device that are separate from the one or more first portions, wherein the one or more capacitive sensors and the one or more pressure sensitive sensor nodes are configured as a single layer on the sensor substrate; and sending one or more inputs corresponding to detection of the object or detection of the pressure. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A sensor assembly configured to provide inputs to a computing device, the sensor assembly comprising:
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a sensor substrate comprising a printed circuit board; a pressure sensitive sensor assembly disposed on one or more first portions of the sensor substrate including a plurality of pressure sensitive sensor nodes configured to detect applied pressure; and a capacitive sensor assembly disposed on one or more second portions of the sensor substrate, the one or more second portions comprising one or more non-overlapping portions of the sensor substrate that are separate from the one or more first portions, the capacitive sensor assembly including a plurality of capacitive sensors configured to detect presence of a proximal object; wherein the capacitive sensor assembly and the pressure sensitive sensor assembly are configured as a single layer on the sensor substrate. - View Dependent Claims (15, 16)
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Specification