Light emitting device and fluidic manufacture thereof

• US 10,230,020 B2
• Filed: 07/14/2017
• Issued: 03/12/2019
• Est. Priority Date: 06/24/2015
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Sasaki, Kenji Alexander, Schuele, Paul J., Crowder, Mark Albert
• Primary Examiner(s): Prenty, Mark
• Application Number:
  US15/650,192
• Publication Number:
  US 20170317242A1
• Time in Patent Office: 606 Days
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/83143 Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/83488 Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/83815 Reflow soldering
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/95146 by surface tension
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0543 : 13th Group
• CPC Class Codes: H01L 2924/0544 : 14th Group
• CPC Class Codes: H01L 2924/0549 : being a combination of two or more materials provided in the groups H01L2924/0531 - H01L2924/0546
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2933/0033 : relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 : with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/483 : Containers
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.

Claims

1. A method of manufacturing a light emitting device comprising:

forming a recess on a substrate;

providing an interlayer dielectric layer over the substrate;

creating a first hole in the interlayer dielectric layer opening over the recess of the substrate;

creating a second hole in the interlayer dielectric layer;

in a first fluid transport stage, fluidically transporting a first micro light emitting device to the first hole; and

in a second fluid transport stage, fluidically transporting a second micro light emitting device to the second hole.

2. The method of manufacturing the light emitting device of claim 1, wherein a flow speed of the first fluid transport stage is faster than a flow speed of the second fluid transport stage.

3. The method of manufacturing a light emitting device of claim 1, wherein a flow speed of the first fluid transport stage is a sustained speed of 5 to 200 μ

m/s during a trapping period of the first fluid transport stage.

4. The method of manufacturing a light emitting device of claim 1, wherein a flow speed of the second fluid transport stage is a sustained speed of 5 to 100 μ

m/s during a trapping period of the second fluid transport stage.

5. The method of manufacturing a light emitting device in the claim 1, wherein the depth of the recess formed in the substrate is substantially equal to a thickness of the first hole in the interlayer dielectric layer.

6. The method of manufacturing a light emitting device of claim 1, further comprising:

creating a third hole in the interlayer dielectric layer; and

in a third fluid transport stage, fluidically transporting a third micro light emitting device to the third hole.

7. The method of manufacturing a light emitting device of claim 1, further comprising:

forming a plurality of through holes in the substrate, each of the through holes corresponding to one of the first and second holes of the interlayer dielectric layer; and

in the first fluid transport stage or the second fluid transport stage, drawing a portion of a transport fluid into the through holes.