Methods of plating or coating ultrasound transducers
First Claim
1. A method of depositing at least one electrode on a base member of an ultrasound transducer, the method comprising:
- cleaning a base member with a cleaning agent, wherein the base member comprises ceramic;
at least partially etching a surface of the base member using a first etching agent comprising a solution of tetrafluoroboric acid and acetate;
catalyzing the surface of the base member using a first catalyst;
plating copper on the surface of the base member using an electroless plating process such that the copper is adjacently deposited onto the base member;
inspecting the copper plated on the surface of the base member;
at least partially etching a surface of the copper-plated surface using a second etching agent;
catalyzing the copper-plated surface using a second catalyst;
plating nickel on the copper-plated surface using an electroless plating process; and
depositing at least one layer of gold on the nickel-plated surface.
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Accused Products
Abstract
According to some embodiments, a method of depositing at least one electrode on a base member of an ultrasound transducer comprises at least partially etching a surface of the base member using a first etching agent, catalyzing the surface of the base member using a first catalyst, plating copper on the surface of the base member using an electroless plating process, inspecting the copper plated on the surface of the base member, at least partially etching a surface of the copper-plated surface using a second etching agent, catalyzing the copper-plated surface using a second catalyst, plating nickel on the copper-plated surface using an electroless plating process and depositing at least one layer of gold on the nickel-plated surface.
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Citations
19 Claims
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1. A method of depositing at least one electrode on a base member of an ultrasound transducer, the method comprising:
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cleaning a base member with a cleaning agent, wherein the base member comprises ceramic; at least partially etching a surface of the base member using a first etching agent comprising a solution of tetrafluoroboric acid and acetate; catalyzing the surface of the base member using a first catalyst; plating copper on the surface of the base member using an electroless plating process such that the copper is adjacently deposited onto the base member; inspecting the copper plated on the surface of the base member; at least partially etching a surface of the copper-plated surface using a second etching agent; catalyzing the copper-plated surface using a second catalyst; plating nickel on the copper-plated surface using an electroless plating process; and depositing at least one layer of gold on the nickel-plated surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification