OLEDs for micro transfer printing
First Claim
Patent Images
1. A structure, comprising:
- a source substrate comprising a patterned sacrificial layer;
a dielectric layer disposed over and in contact with the patterned sacrificial layer, the patterned sacrificial layer disposed between the source substrate and the dielectric layer;
an organic light-emitting diode (OLED) disposed on and in contact with the dielectric layer and exclusively over the patterned sacrificial layer, the OLED comprising a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material, wherein the first electrode and second electrode are both in contact with the dielectric layer;
a protective layer disposed on or over the OLED and in direct contact with the dielectric layer around a periphery of the OLED to encapsulate the OLED; and
one or more fracturable tethers disposed over the patterned sacrificial layer and extending from a periphery of the organic light-emitting diode that exclusively connect the OLED to one or more anchor portions of the source substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
An organic light-emitting diode (OLED) structure includes an organic light-emitting diode having a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material. At least a portion of a tether extending from a periphery of the organic light-emitting diode. The organic light-emitting diodes can be printable organic light-emitting diode structures that are micro transfer printed over a display substrate to form a display.
-
Citations
15 Claims
-
1. A structure, comprising:
-
a source substrate comprising a patterned sacrificial layer; a dielectric layer disposed over and in contact with the patterned sacrificial layer, the patterned sacrificial layer disposed between the source substrate and the dielectric layer; an organic light-emitting diode (OLED) disposed on and in contact with the dielectric layer and exclusively over the patterned sacrificial layer, the OLED comprising a first electrode, one or more layers of organic material disposed on at least a portion of the first electrode, and a second electrode disposed on at least a portion of the one or more layers of organic material, wherein the first electrode and second electrode are both in contact with the dielectric layer; a protective layer disposed on or over the OLED and in direct contact with the dielectric layer around a periphery of the OLED to encapsulate the OLED; and one or more fracturable tethers disposed over the patterned sacrificial layer and extending from a periphery of the organic light-emitting diode that exclusively connect the OLED to one or more anchor portions of the source substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
Specification