Optical die test interface with separate voltages for adjacent electrodes
First Claim
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1. A method comprising:
- providing a wafer comprising a first die and a scribe grid surrounding the first die,the first die comprising a first optical waveguide beam located in a first structure at a peripheral die edge of the first die and surrounded by a plurality of separate deflection electrodes which are positioned to exert two-dimensional deflection of the first optical waveguide beam and which comprise first and second separate lateral deflection electrodes positioned on a first side of the first optical waveguide beam and separately connected to different, independently controlled voltages, andthe scribe grid comprising an optical deflection mirror for perpendicularly deflecting optical signals located in a second structure proximate to the peripheral die edge of the first die;
forming a recess opening in the scribe grid of the wafer to reveal or release at least the first optical waveguide beam at the peripheral die edge of the first die; and
performing one or more optical wafer die tests on the first die using at least a first optical signal that is received in a first plane that is perpendicular to a lateral plane of the wafer and perpendicularly deflected at the optical deflection mirror into the lateral plane of the wafer for transmission across the recess opening for reception at the first optical waveguide beam.
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Abstract
An integrated circuit optical die test interface and associated testing method are described for using scribe area optical mirror structures (106) to perform wafer die tests on MEMS optical beam waveguide (112) and optical circuit elements (113) by perpendicularly deflecting optical test signals (122) from the scribe area optical mirror structures (106) into and out of the plane of the integrated circuit die under test (104) and/or production test die (157).
136 Citations
20 Claims
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1. A method comprising:
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providing a wafer comprising a first die and a scribe grid surrounding the first die, the first die comprising a first optical waveguide beam located in a first structure at a peripheral die edge of the first die and surrounded by a plurality of separate deflection electrodes which are positioned to exert two-dimensional deflection of the first optical waveguide beam and which comprise first and second separate lateral deflection electrodes positioned on a first side of the first optical waveguide beam and separately connected to different, independently controlled voltages, and the scribe grid comprising an optical deflection mirror for perpendicularly deflecting optical signals located in a second structure proximate to the peripheral die edge of the first die; forming a recess opening in the scribe grid of the wafer to reveal or release at least the first optical waveguide beam at the peripheral die edge of the first die; and performing one or more optical wafer die tests on the first die using at least a first optical signal that is received in a first plane that is perpendicular to a lateral plane of the wafer and perpendicularly deflected at the optical deflection mirror into the lateral plane of the wafer for transmission across the recess opening for reception at the first optical waveguide beam. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for making an integrated circuit device comprising:
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providing a first die that is surrounded by a first scribe grid while in wafer form, the first die comprising a first optical waveguide beam located at a peripheral die edge of the first die that is surrounded by a plurality of separate deflection electrodes which are positioned to exert two-dimensional deflection of the first optical waveguide beam and which comprise first and second separate lateral deflection electrodes positioned on a first side of the first optical waveguide beam and separately connected to different, independently controlled voltages; and performing one or more optical wafer die probe tests on the first die while in wafer form after forming a recess opening in the scribe grid of the wafer to reveal or release the first optical waveguide beam; where the first scribe grid comprises an optical deflection mirror located proximate to the peripheral die edge of the first die for perpendicularly deflecting optical signals to and/or from the first optical waveguide beam, and where the one or more optical wafer die probe tests are performed on the first die by using an optical test signal that is received in a first plane that is perpendicular to a lateral plane of the first die and that is perpendicularly deflected at the optical deflection mirror into the lateral plane of the first die for reception at the first optical waveguide beam for use in optical testing of optical circuit elements in the first die. - View Dependent Claims (15, 16, 17, 18)
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- 19. A semiconductor wafer comprising a plurality of scribe street regions surrounding a corresponding plurality of die, where each die comprises optical circuit elements and a deflectable optical waveguide beam located at a peripheral die edge of said die and surrounded by a plurality of separate deflection electrodes which are positioned to exert two-dimensional deflection of the optical waveguide beam, and which comprise first and second separate lateral deflection electrodes positioned on a first side of the deflectable optical waveguide beam and separately connected to different, independently controlled voltages, and where each scribe street region surrounding a die comprises a scribe street optical deflection mirror for receiving optical signals in a first plane that is perpendicular to a lateral plane of the wafer and for perpendicularly deflecting the received optical signals for optical communication through the deflectable optical waveguide beam for use in optical testing of the optical circuit elements.
Specification