Placement of vias in printed circuit board circuits
First Claim
1. An electronic device comprising a printed circuit board (PCB) device comprising:
- a first trace on a first layer;
a second trace on a second layer, wherein the second trace is electrically isolated from the first trace;
a first trace via including a first pad on the first layer, wherein the first pad is electrically connected to the first trace;
a second trace via including a second pad on the second layer, wherein the second pad is electrically connected to the second trace;
at least one antipad surrounding the first trace via and the second trace via;
a first ground via electrically connected to a ground plane, wherein the first ground via includes a first ground pad on the first layer positioned between and surrounded by the first trace and the second trace, and wherein the first ground pad is approximately centered on a perpendicular bisector of a line from the first pad to the second pad;
a second ground via electrically connected to the ground plane, wherein the second ground via includes a second ground pad; and
a third ground via electrically connected to the ground plane, wherein the third ground via includes a third ground pad, wherein the second ground pad and the third ground pad are approximately symmetrically positioned about the perpendicular bisector, and wherein each ground pad of the second ground pad and the third ground pad is approximately centered on the line from the first pad to the second pad.
1 Assignment
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Accused Products
Abstract
In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.
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Citations
9 Claims
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1. An electronic device comprising a printed circuit board (PCB) device comprising:
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a first trace on a first layer; a second trace on a second layer, wherein the second trace is electrically isolated from the first trace; a first trace via including a first pad on the first layer, wherein the first pad is electrically connected to the first trace; a second trace via including a second pad on the second layer, wherein the second pad is electrically connected to the second trace; at least one antipad surrounding the first trace via and the second trace via; a first ground via electrically connected to a ground plane, wherein the first ground via includes a first ground pad on the first layer positioned between and surrounded by the first trace and the second trace, and wherein the first ground pad is approximately centered on a perpendicular bisector of a line from the first pad to the second pad; a second ground via electrically connected to the ground plane, wherein the second ground via includes a second ground pad; and a third ground via electrically connected to the ground plane, wherein the third ground via includes a third ground pad, wherein the second ground pad and the third ground pad are approximately symmetrically positioned about the perpendicular bisector, and wherein each ground pad of the second ground pad and the third ground pad is approximately centered on the line from the first pad to the second pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification