Copper interconnect for PTH components assembly

• US 10,231,333 B1
• Filed: 06/17/2014
• Issued: 03/12/2019
• Est. Priority Date: 08/27/2013
• Status: Active Grant

• Current Assignee: Flextronics America LLC (Flextronics International Limited)
• Original Assignee: Flextronics America LLC (Flextronics International Limited)
• Inventors: Liu, Weifeng, Feng, Zhen, Mohammed, Anwar, Geiger, David, Kurwa, Murad
• Primary Examiner(s): Aychillhum, Andargie M
• Application Number:
  US14/307,201
• Time in Patent Office: 1,729 Days
• Field of Search: 361772, 174257, 174264
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/321 by conductive adhesives

Abstract

Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.

Claims

1. An apparatus comprising an aperture on an electronic board,

wherein the aperture contains an amount of conductive copper nanoparticles dispersed in a solvent, wherein the aperture contains a plated area extending the entire depth of the aperture that is void of the conductive copper nanoparticles.

2. The apparatus of claim 1, wherein the aperture comprises a plated through hole.

3. The apparatus of claim 1, wherein the electronic board comprises a printed circuit board.

4. The apparatus of claim 1, wherein the conductive particles comprise a nano copper ink.

5. The apparatus of claim 1, further comprising a pin.

6. The apparatus of claim 5, wherein the pin blocks the bottom of the aperture forming a seal preventing the conductive particles from leaking out from the aperture.

7. The apparatus of claim 6, wherein a portion of the pin is inside the aperture and forms the void.

8. The apparatus of claim 1, wherein the area is centrally located within the aperture.

9. An apparatus comprising:

an electronic board including;

a through hole with a first end and a second end, the through hole having plated side walls; and

a filling area formed by a barrel, wherein the filling area extends beyond the ends of the through hole; and

an amount of conductive copper nanoparticles dispersed in a solvent that is in the through hole, wherein the solvent fills the entire through hole except for the plated side walls and covers an internal surface of the barrel and beyond both ends of the through hole.

10. The apparatus of claim 9, further comprising a pin located in the through hole, wherein a standoff stand of the pin blocks one of the ends of the through hole by coupling with a pad located at an edge of the one end.

11. The apparatus of claim 10, further comprising a package, wherein the standoff stand abuts a top surface of the package and is between the electronic board and the package.

12. The apparatus of claim 11, wherein the electronic board comprises a printed circuit board.

13. The apparatus of claim 12, wherein the conductive particles comprise a nano copper ink.