Folded printed circuit assemblies and related methods
First Claim
1. A method for assembling a printed circuit assembly, the method comprising the steps of:
- obtaining a first printed circuit board electrically coupled with a second printed circuit board along at least one flexible coupling member, wherein the first printed circuit board comprises a rigid, printed circuit board having a flexibility less than a flexibility of the flexible coupling member, wherein the second printed circuit board comprises a rigid, printed circuit board having a flexibility less than the flexibility of the flexible coupling member, wherein the first printed circuit board comprises a first plurality of electrical components, and wherein the second printed circuit board comprises a second plurality of electrical components;
applying an adhesive barrier to at least one of the first printed circuit board and the second printed circuit board;
applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board, wherein the first adhesive layer forms a layer along each electrical component of the at least one of the first printed circuit board and the second printed circuit board, wherein the step of applying an adhesive barrier is performed before the step of applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board, wherein the adhesive barrier defines an enclosed perimeter, and wherein the step of applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board comprises pouring a liquid adhesive into the adhesive barrier; and
stacking the first printed circuit board relative to the second printed circuit board to form a stacked, printed circuit assembly.
2 Assignments
0 Petitions
Accused Products
Abstract
Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first printed circuit board comprising a first plurality of electrical components may be coupled with a second printed circuit board comprising a second plurality of electrical components using a flexible coupling member. The first printed circuit board may be stacked on top of the second printed circuit board and coupled using an adhesive layer positioned in between the first printed circuit board and the second printed circuit board. The adhesive layer may be configured to maintain the first printed circuit board in a stacked configuration with respect to the second printed circuit board.
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Citations
11 Claims
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1. A method for assembling a printed circuit assembly, the method comprising the steps of:
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obtaining a first printed circuit board electrically coupled with a second printed circuit board along at least one flexible coupling member, wherein the first printed circuit board comprises a rigid, printed circuit board having a flexibility less than a flexibility of the flexible coupling member, wherein the second printed circuit board comprises a rigid, printed circuit board having a flexibility less than the flexibility of the flexible coupling member, wherein the first printed circuit board comprises a first plurality of electrical components, and wherein the second printed circuit board comprises a second plurality of electrical components; applying an adhesive barrier to at least one of the first printed circuit board and the second printed circuit board; applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board, wherein the first adhesive layer forms a layer along each electrical component of the at least one of the first printed circuit board and the second printed circuit board, wherein the step of applying an adhesive barrier is performed before the step of applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board, wherein the adhesive barrier defines an enclosed perimeter, and wherein the step of applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board comprises pouring a liquid adhesive into the adhesive barrier; and stacking the first printed circuit board relative to the second printed circuit board to form a stacked, printed circuit assembly. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for assembling a printed circuit assembly, the method comprising the steps of:
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obtaining a first printed circuit board electrically coupled with a second printed circuit board along at least one flexible coupling member, wherein the first printed circuit board comprises a rigid, printed circuit board having a flexibility less than a flexibility of the flexible coupling member, wherein the second printed circuit board comprises a rigid, printed circuit board having a flexibility less than the flexibility of the flexible coupling member, wherein the first printed circuit board comprises a first plurality of electrical components, and wherein the second printed circuit board comprises a second plurality of electrical components; applying a first adhesive layer to at least one of the first printed circuit board and the second printed circuit board, wherein the first adhesive layer forms a layer along each electrical component of the at least one of the first printed circuit board and the second printed circuit board, and wherein the first adhesive layer encapsulates electrical components of the at least one of the first printed circuit board and the second printed circuit board; and stacking the first printed circuit board relative to the second printed circuit board to form a stacked, printed circuit assembly.
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Specification