Anodizing resistant components and methods of use thereof

• US 10,231,352 B2
• Filed: 09/11/2012
• Issued: 03/12/2019
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Woodhull, Charles B., Choiniere, Paul, Coleman, Michael, Kiple, Bryan Patrick, Pakula, David A., Pilliod, Michael K., Tan, Tang Yew
• Primary Examiner(s): Wittenberg, Stefanie S
• Application Number:
  US13/610,816
• Publication Number:
  US 20130319872A1
• Time in Patent Office: 2,373 Days
• Field of Search: 205120
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing roughing and finishing B23C2220/605
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Claims

1. A method of forming a multi-part enclosure for an electronic device, the multi-part enclosure including at least a first metal section and a second metal section, wherein the multi-part enclosure is characterized as having a width that extends between exterior surfaces of opposing sidewalls of the first and second metal sections, the method comprising:

locking together the first metal section and the second metal section in a locked configuration by injection molding a first shot component comprised of a first liquid material into recessed locking members included in the first and second metal sections, wherein the recessed locking members span the width of the multi-part enclosure such that the first liquid material hardens to form a coupling member that locks with the recessed locking members so as to electrically isolate the first metal section from the second metal section, wherein in the locked configuration, a surface of the first shot component is unprotected from an anodization process performed at the exterior surfaces of the opposing sidewalls;

injection molding a second shot component comprised of a second liquid material to cover and protect at least the surface of the first shot component from the anodization process performed at the exterior surfaces of the opposing sidewalls subsequent to the injection molding of the second shot component;

performing the anodization process at the exterior surfaces of the opposing sidewalls corresponding to the second shot component, wherein the first shot component is protected from the anodization process by the second shot component; and

machining the coupling member to form a recess that is capable of carrying an electronic component therein.

2. The method recited in claim 1, wherein the multi-part enclosure is characterized as having a height that extends between a top surface of the first metal section and a bottom surface of the second metal section, and the height is greater than the width.

3. The method recited in claim 1, wherein the second shot component completely covers the first shot component and includes an exterior surface that is flush with the exterior surfaces of the opposing sidewalls.

4. The method recited in claim 1, wherein the first and second liquid materials are plastic material.

5. The method recited in claim 1, wherein the recessed locking members are included at the opposing sidewalls of the first and second metal sections.

6. The method recited in claim 1, wherein the second shot component is self-anchored within a cavity that is filled by the first shot component.

7. The method recited in claim 1, wherein, subsequent to injection molding the second shot component, the first shot component is completely surrounded by the second shot component.

8. The method recited in claim 1, wherein the first shot component is comprised of a thermoplastic polymer resin.

9. The method recited in claim 1, wherein the first shot component is comprised of glass filled polyaryletherketone (PAEK) material or polyethylene terephthalate (PET) material.

10. The method recited in claim 1, wherein the second liquid material in a hardened state is softer than the first liquid material in a hardened state.

11. The method recited in claim 1, wherein the multi-part enclosure further includes a third metal section, and the recessed locking members span the width of the third metal section.

12. A method for forming a multi-part enclosure, the multi-part enclosure including at least a first metal section and a second metal section, wherein the multi-part enclosure is characterized as having a width that extends between opposing sidewalls of the first and second metal sections, the method comprising:

locking together the first metal section with the second metal section by injection molding a first shot component into recessed locking members of the first and second metal sections, the first shot component being comprised of a first material, wherein the recessed locking members span the width of the multi-part enclosure such that when the first shot component hardens to form a coupling member, the first and second metal sections are locked together and electrically isolated from each other by the coupling member;

injection molding a second shot component to cover any exposed surfaces of the first shot component, the second shot component comprised of a second material that is different than the first material and is resistant to an anodization process;

anodizing exterior surfaces of the opposing sidewalls, wherein the second shot component protects the first shot component from the anodization process; and

machining the coupling member to form a recess that is capable of carrying an electronic component therein.

13. The method recited in claim 12, wherein the multi-part enclosure is characterized as having a height that extends between a top surface of the first metal section and a bottom surface of the second metal section, and the height is greater than the width.

14. The method recited in claim 12, wherein the recessed locking members correspond to the opposing sidewalls of the multi-part enclosure.

15. The method recited in claim 12, wherein the first shot component is comprised of a thermoplastic polymer resin, a glass filled polyaryletherketone (PAEK) material or a polyethylene terephthalate (PET) material.

16. A method of forming a multi-part enclosure for an electronic device, the multi-part enclosure including at least a first metal section and a second metal section, wherein the multi-part enclosure has a width that extends between exterior surfaces of sidewalls of the first and second metal sections, the method comprising:

locking together the first metal section with the second metal section by injection molding a first shot component at recessed locking members of the first and second metal sections, wherein the recessed locking members extend along the width of the multi-part enclosure such that when the first shot component hardens to form a coupling member, the first and second metal sections are locked together and electrically isolated from each other by the coupling member;

machining the first shot component to form retaining features that includes a locking structure capable of accepting a second shot component;

injection molding the second shot component into the locking structure such that the second shot component is self-anchored to the first shot component, wherein the second shot component prevents the first shot component from being viewable and protects the first shot component from an anodization process; and

machining the coupling member to form a recess that is capable of carrying an electronic component therein.

17. The method recited in claim 16, wherein the multi-part enclosure further includes a third metal section, and the first and third metal sections are separated by the second metal section.

18. The method as recited in claim 17, wherein the multi-part enclosure is characterized as having a height that extends between a top surface of the first metal section and a bottom surface of the third metal section, and the height is greater than the width.