Methods of manufacturing jaw members of an end-effector assembly for a surgical instrument
First Claim
1. A method of manufacturing a jaw member of an end-effector assembly, comprising:
- forming at least one stress-relief cavity in an electrically-conductive surface of a sealing plate, each one of the at least one stress-relief cavities defining a pad portion having a pad surface coincident with the remainder of the electrically-conductive surface of the sealing plate; and
depositing a material on the pad surface of each pad portion to form a stop member thereon, each pad portion surrounded by one of the at least one stress-relief cavities, each one of the at least one stress-relief cavities functioning as a wetting ring to limit the spread of the material, wherein each one of the at least one stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during an overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the pad surface of the electrically-conductive surface of the sealing plate.
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Accused Products
Abstract
A method of manufacturing a jaw member of an end-effector assembly includes forming one or more stress-relief cavities within a sealing plate. Each one of the one or more stress-relief cavities defines a pad portion of an electrically-conductive surface of the sealing plate. The method also includes forming a stop member on each pad portion of the electrically-conductive surface of the sealing plate, performing an overmolding operation wherein the one or more stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during the overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the electrically-conductive surface of the sealing plate.
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Citations
7 Claims
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1. A method of manufacturing a jaw member of an end-effector assembly, comprising:
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forming at least one stress-relief cavity in an electrically-conductive surface of a sealing plate, each one of the at least one stress-relief cavities defining a pad portion having a pad surface coincident with the remainder of the electrically-conductive surface of the sealing plate; and depositing a material on the pad surface of each pad portion to form a stop member thereon, each pad portion surrounded by one of the at least one stress-relief cavities, each one of the at least one stress-relief cavities functioning as a wetting ring to limit the spread of the material, wherein each one of the at least one stress-relief cavities is configured to prevent force applied to a bottom surface of the sealing plate during an overmolding operation from stressing each pad portion to avoid compromising adhesion between the stop member and the pad surface of the electrically-conductive surface of the sealing plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification