Multilayer structure for capacitive pressure sensing
First Claim
1. A method for manufacturing a multilayer structure, the method comprising:
- printing a plurality of flexible sensor pads on a flexible substrate film;
printing conductor traces on the flexible substrate film to electrically connect each flexible sensor pad of the plurality of flexible sensor pads with an electronic circuit, each conductive trace connecting one of the plurality of flexible sensor pads with the electronic circuit;
providing the electronic circuit on the flexible substrate film to control capacitive measurements via the plurality of flexible sensor pads to obtain an indication of pressure subjected to the multilayer structure and to monitor a capacitance between each flexible sensor pad of the plurality of flexible sensor pads and a sole of a user placed upon the structure and functionally forming a capacitor with the at least one flexible sensor pad of the plurality of flexible sensor pads the electronic circuit overmolded with a first material layer after the electronic circuit is provided on the flexible substrate;
attaching a Surface-Mount Device (SMD) to the flexible substrate film;
providing a power supply element for supplying electricity-driven components including the electronic circuit with electricity; and
molding a second material layer being a plastic layer upon the flexible substrate film substantially embedding the plurality of flexible sensor pads, the conductor traces, the SMD, and the electronic circuit therewithin.
2 Assignments
0 Petitions
Accused Products
Abstract
A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.
16 Citations
16 Claims
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1. A method for manufacturing a multilayer structure, the method comprising:
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printing a plurality of flexible sensor pads on a flexible substrate film; printing conductor traces on the flexible substrate film to electrically connect each flexible sensor pad of the plurality of flexible sensor pads with an electronic circuit, each conductive trace connecting one of the plurality of flexible sensor pads with the electronic circuit; providing the electronic circuit on the flexible substrate film to control capacitive measurements via the plurality of flexible sensor pads to obtain an indication of pressure subjected to the multilayer structure and to monitor a capacitance between each flexible sensor pad of the plurality of flexible sensor pads and a sole of a user placed upon the structure and functionally forming a capacitor with the at least one flexible sensor pad of the plurality of flexible sensor pads the electronic circuit overmolded with a first material layer after the electronic circuit is provided on the flexible substrate; attaching a Surface-Mount Device (SMD) to the flexible substrate film; providing a power supply element for supplying electricity-driven components including the electronic circuit with electricity; and molding a second material layer being a plastic layer upon the flexible substrate film substantially embedding the plurality of flexible sensor pads, the conductor traces, the SMD, and the electronic circuit therewithin. - View Dependent Claims (2, 3)
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4. A method of manufacturing a garment, the method comprising:
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printing a plurality of flexible sensor pads on a flexible substrate film; printing a conductor traces on the flexible substrate film to electrically connect each flexible sensor pad of the plurality flexible sensor pads with an electronic circuit; providing the electronic circuit on the flexible substrate film to control capacitive measurements via the plurality of flexible sensor pads to obtain an indication of pressure subjected to the multilayer structure and to monitor a capacitance between the each flexible sensor pad of the plurality of flexible sensor pads and a sole of a user placed upon the structure and functionally forming a capacitor with the at least one flexible sensor pad of the plurality of flexible sensor pads the electronic circuit overmolded with a first material layer after the electronic circuit is provided on the flexible substrate; attaching a Surface-Mount Device (SMD) to the flexible substrate film; providing a power supply element for supplying electricity-driven components including the electronic circuit with electricity; molding a second material layer being a plastic layer upon the flexible substrate film substantially embedding the number of flexible sensor pads, the conductor traces, the SMD, and the electronic circuit therewithin; and integrating the flexible substrate film into a garment. - View Dependent Claims (5, 6, 7)
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8. A multilayer structure comprising:
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a flexible substrate film; a plurality of flexible sensor pads printed on the flexible substrate film; an electronic circuit further provided on the flexible substrate film to control capacitive measurements via the plurality of flexible sensor pads to obtain an indication of pressure subjected to the multilayer structure and to monitor a capacitance between each flexible sensor pad of the plurality of flexible sensor pads and a sole of a user placed upon the structure and functionally forming a capacitor with at least one flexible sensor pad of the plurality of flexible sensor pads; conductor traces printed on the flexible substrate film to electrically connect the electronic circuit and flexible sensor pads of the plurality of flexible sensor pads, the electronic circuit and a portion of the conductor traces overmolded with a first material layer; a Surface-Mount Device (SMD) attached to the flexible substrate film; a power supply element for powering electricity-driven components including the electronic circuit; and a second material layer being a plastic layer molded upon the flexible substrate film substantially embedding the plurality of flexible sensor pads, the conductor traces, the SMD, and the electronic circuit therewithin, the SMD configured to be attached to the flexible substrate film as the at least one plastic layer is molded upon the flexible substrate film. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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Specification