Optical fingerprint recognition sensor package

• US 10,235,555 B2
• Filed: 01/12/2018
• Issued: 03/19/2019
• Est. Priority Date: 11/23/2016
• Status: Active Grant

• Current Assignee: Tron Intelligence Inc.
• Original Assignee: Tron Intelligence Inc.
• Inventors: Tzu, Da-Ching, Lin, Ruey-Jiann
• Primary Examiner(s): Nguyen, Thanh T
• Application Number:
  US15/869,323
• Publication Number:
  US 20180144175A1
• Time in Patent Office: 431 Days
• CPC Class Codes: G06V 40/1318 using electro-optical elements or layers, e.g. electroluminescent sensing
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32227 the layer connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48157 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48177 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/165 : Containers
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 27/14678 : Contact-type imagers
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/18165 : of a wire bonded chip
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10151 : Sensor

Abstract

An optical fingerprint recognition sensor package, which comprises a carrier, at least one image sensor, at least one light emitting diode, a first molding compound and at least one second molding compound is provided. The image sensor is disposed on the carrier and being electrically connected thereto. The at least one light emitting diode is peripherally surrounding the image sensor for providing at least one light source. The first molding compound made of infrared material is configured to be adjacent to the image sensor to hinder ambient lights from interfering with the image sensor. The second molding compound made of colored silicone is disposed over the light emitting diode to provide lighting path for the light source. By employing the proposed present invention, interferences from the ambient lights with the image sensor can be effectively avoided, thus increasing the accuracy and precision of the sensing results.

Claims

1. An optical fingerprint recognition sensor package, comprising:

a carrier;

at least one image sensor disposed on said carrier and being electrically connected with said carrier;

at least one light emitting diode, peripherally surrounding said image sensor for providing at least one light source, wherein when a user'"'"'s fingerprint is generated for recognition, said at least one light source is provided for lighting and helping said image sensor to capture and sense an image of said fingerprint;

a first molding compound, made of infrared (IR) molding compound and configured to be adjacent to said at least one image sensor so as to hinder ambient lights from interfering with said image sensor; and

at least one second molding compound, made of colored silicone, disposed over said at least one light emitting diode and providing at least one lighting path for said at least one light source respectively.

2. The optical fingerprint recognition sensor package according to claim 1, wherein said first molding compound is configured to be covering said at least one image sensor.

3. The optical fingerprint recognition sensor package according to claim 2, wherein said at least one second molding compound is configured to be covering said at least one light emitting diode.

4. The optical fingerprint recognition sensor package according to claim 3, wherein said at least one second molding compound is further configured to be covering said first molding compound.

5. The optical fingerprint recognition sensor package according to claim 1, wherein said first molding compound is configured to be on at least one sidewall of said at least one image sensor.

6. The optical fingerprint recognition sensor package according to claim 5, wherein said at least one second molding compound is configured to be disposed in between said first molding compound and said at least one light emitting diode.

7. The optical fingerprint recognition sensor package according to claim 1, further comprising a plurality of pads, which are in connection with said carrier and said at least one image sensor.

8. The optical fingerprint recognition sensor package according to claim 1, wherein said at least one light emitting diode is mounted on said carrier through an adhesive layer by surface-mount technology (SMT).

9. The optical fingerprint recognition sensor package according to claim 8, wherein said adhesive layer is a red glue or a silver paste.

10. The optical fingerprint recognition sensor package according to claim 9, wherein said at least one light emitting diode is flip-chip mounted upon said carrier through said adhesive layer.

11. The optical fingerprint recognition sensor package according to claim 1, wherein said carrier is a substrate or a lead frame.

12. The optical fingerprint recognition sensor package according to claim 1, wherein said at least one light emitting diode is an infrared (IR) LED.

13. The optical fingerprint recognition sensor package according to claim 1, wherein said at least one image sensor is a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS).

14. The optical fingerprint recognition sensor package according to claim 1, wherein said carrier further comprises a first part and at least one second part respectively for disposing said image sensor and said at least one light emitting diode, and said first part and said at least one second part are separated.

15. The optical fingerprint recognition sensor package according to claim 14, wherein said image sensor is electrically connected with said at least one second part by conductive wire bonding.

16. The optical fingerprint recognition sensor package according to claim 14, wherein said at least one light emitting diode is electrically connected with said at least one second part by conductive wire bonding.