Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
First Claim
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1. A method of depositing a doped germanium tin (Ge1-xSnx) semiconductor comprising:
- providing a substrate within a reaction chamber;
heating the substrate to a deposition temperature;
exposing the substrate to a germanium precursor and a tin precursor in the reaction chamber;
depositing a germanium tin (Ge1-xSnx) semiconductor on a surface of the substrate;
after the step of deposting, removing the germanium precursor and the tin precursor from the reaction chamber;
after the step of removing, exposing the germanium tin (Ge1-xSnx) semiconductor to a boron dopant precursor while no tin precursor and no germanium precursor are introduced to the reaction chamber; and
after the step of exposing, annealing the germanium tin (Ge1-xSnx) semiconductor.
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Abstract
A method for depositing a germanium tin (Ge1-xSnx) semiconductor is disclosed. The method may include; providing a substrate within a reaction chamber, heating the substrate to a deposition temperature and exposing the substrate to a germanium precursor and a tin precursor. The method may further include; depositing a germanium tin (Ge1-xSnx) semiconductor on the surface of the substrate, and exposing the germanium tin (Ge1-xSnx) semiconductor to a boron dopant precursor. Semiconductor device structures including a germanium tin (Ge1-xSnx) semiconductor formed by the methods of the disclosure are also provided.
2033 Citations
20 Claims
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1. A method of depositing a doped germanium tin (Ge1-xSnx) semiconductor comprising:
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providing a substrate within a reaction chamber; heating the substrate to a deposition temperature; exposing the substrate to a germanium precursor and a tin precursor in the reaction chamber; depositing a germanium tin (Ge1-xSnx) semiconductor on a surface of the substrate; after the step of deposting, removing the germanium precursor and the tin precursor from the reaction chamber; after the step of removing, exposing the germanium tin (Ge1-xSnx) semiconductor to a boron dopant precursor while no tin precursor and no germanium precursor are introduced to the reaction chamber; and after the step of exposing, annealing the germanium tin (Ge1-xSnx) semiconductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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