Method for transferring device

• US 10,236,195 B1
• Filed: 12/20/2017
• Issued: 03/19/2019
• Est. Priority Date: 12/20/2017
• Status: Active Grant

• Current Assignee: Mikro Mesa Technology Co., Ltd.
• Original Assignee: Mikro Mesa Technology Co., Ltd.
• Inventors: Chen, Li-Yi, Lin, Shih-Chyn
• Primary Examiner(s): Coleman, William
• Application Number:
  US15/847,942
• Time in Patent Office: 454 Days
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination

Abstract

A method for transferring a device includes the following steps: forming a pliable adhesive layer on a carrier substrate; placing the device over the pliable adhesive layer; contacting a transfer head assembly with the device, in which a pliable dielectric layer of the transfer head assembly is in contact with the device during the contacting and more pliable than the device, such that the pliable dielectric layer of the transfer head assembly deforms during the contacting, and the pliable adhesive layer is more pliable than the device, such that the pliable adhesive layer deforms during the contacting; actuating the transfer head assembly to create a grip force; picking up the device by the grip force created by the transfer head assembly; and placing the device onto a receiving substrate.

Claims

1. A method for transferring a device, the method comprising:

forming a pliable adhesive layer on a carrier substrate;

placing the device over the pliable adhesive layer;

contacting a transfer head assembly with the device, wherein a pliable dielectric layer of the transfer head assembly is in contact with the device during the contacting and more pliable than the device, the pliable adhesive layer is more pliable than the device, and the pliable dielectric layer comprises a plurality of particles;

actuating the transfer head assembly to create a grip force;

picking up the device by the grip force created by the transfer head assembly; and

placing the device onto a receiving substrate.

2. The method of claim 1, wherein when the transfer head assembly is contacting the device, at least a portion of the pliable dielectric layer is between an electrode of the transfer head assembly and the device.

3. The method of claim 1, wherein the pliable dielectric layer returns to its original shape before next picking up.

4. The method of claim 1, wherein the transfer head assembly comprises:

a base plate;

a transfer head located on the base plate, wherein the transfer head comprises an electrode located on the base plate; and

the pliable dielectric layer covering the electrode.

5. The method of claim 1, wherein the pliable dielectric layer comprises a polymer material.

6. The method of claim 1, wherein a dielectric constant of the particles is greater than a dielectric constant of the pliable dielectric layer.

7. The method of claim 1, wherein the particles comprise a high-k material.

8. The method of claim 1, wherein when the transfer head assembly is contacting the device, at least a portion of the particles is between an electrode of the transfer head assembly and the device.

9. The method of claim 1, further comprising:

irradiating at least one electromagnetic wave to the pliable adhesive layer through the carrier substrate to reduce an adhesion pressure of the pliable adhesive layer to the device.

10. The method of claim 1, wherein the device placed over the pliable adhesive layer is a chipped device with a patterned photoresist layer thereon.

11. The method of claim 2, wherein the transfer head assembly picks up the device by a Coulomb force, a Johnsen-Rahbek effect, or combinations thereof.

12. The method of claim 4, wherein the base plate permits at least partial passage of visible light, infrared light, ultraviolet light, or combinations thereof.

13. The method of claim 4, wherein the base plate has at least one recess therein, and the pliable dielectric layer further conformally covers a sidewall and a bottom of the recess.

14. The method of claim 4, wherein the base plate has at least one recess therein, and a sidewall and a bottom of the recess are free from coverage of the pliable dielectric layer.

15. The method of claim 4, wherein the electrode of the transfer head is electrical unipolar.

16. The method of claim 4, wherein a pair of the electrodes of the transfer head is electrical bipolar.

17. The method of claim 13, wherein a number of the at least one recess is plural, and at least two of the recesses are isolated from each other when viewing a side of the transfer head assembly where said at least one device is intended to be gripped.

18. The method of claim 14, wherein a number of the at least one recess is plural, and at least two of the recesses are isolated from each other when viewing a side of the transfer head assembly where said at least one device is intended to be gripped.

19. The method of claim 10, wherein the placing the device over the pliable adhesive layer comprises:

placing an unchipped device over the pliable adhesive layer;

coating a photoresist layer over the unchipped device;

patterning the photoresist layer; and

etching the unchipped device through the patterned photoresist layer, such that the unchipped device is chipped into the chipped device.