Cobalt top layer advanced metallization for interconnects
First Claim
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1. A method for fabricating an advanced metal conductor structure comprising:
- providing a pattern in a dielectric layer, wherein the pattern includes a set of features in the dielectric for a set of metal conductor structures;
creating an adhesion promoting layer disposed on the patterned dielectric;
depositing a metal layer to fill a first portion of the set of features disposed on the adhesion promoting layer;
depositing a ruthenium layer disposed on the metal layer;
performing a nitridation process which nitridizes at least a surface portion of the ruthenium layer;
using a physical vapor deposition process to deposit a cobalt layer disposed over the nitridized surface portion of the ruthenium layer, the physical vapor deposition used to deposit all of the cobalt layer; and
performing a thermal anneal which reflows the cobalt layer to completely fill a second portion of the set of features, wherein the second portion of the set of features is a remainder portion of the set of features remaining unfilled from previous depositions.
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Abstract
A method for constructing an advance conductor structure is described. A pattern is provided in a dielectric layer in which a set of features are patterned for a set of metal conductor structures. An adhesion promoting layer is created disposed over the patterned dielectric. A metal layer is deposited to fill a first portion of the set of features disposed the adhesion promoting layer. A ruthenium layer is deposited disposed over the metal layer. Using a physical vapor deposition process, a cobalt layer is deposited disposed over the ruthenium layer. A thermal anneal reflows the cobalt layer to fill a second portion of the set of features.
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8 Claims
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1. A method for fabricating an advanced metal conductor structure comprising:
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providing a pattern in a dielectric layer, wherein the pattern includes a set of features in the dielectric for a set of metal conductor structures; creating an adhesion promoting layer disposed on the patterned dielectric; depositing a metal layer to fill a first portion of the set of features disposed on the adhesion promoting layer; depositing a ruthenium layer disposed on the metal layer; performing a nitridation process which nitridizes at least a surface portion of the ruthenium layer; using a physical vapor deposition process to deposit a cobalt layer disposed over the nitridized surface portion of the ruthenium layer, the physical vapor deposition used to deposit all of the cobalt layer; and performing a thermal anneal which reflows the cobalt layer to completely fill a second portion of the set of features, wherein the second portion of the set of features is a remainder portion of the set of features remaining unfilled from previous depositions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification