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Semiconductor device

  • US 10,236,305 B2
  • Filed: 08/15/2017
  • Issued: 03/19/2019
  • Est. Priority Date: 09/13/2012
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a first conductive film;

    a gate insulating film over the first conductive film; and

    a first metal oxide film over the gate insulating film;

    a second metal oxide film over the gate insulating film;

    a second conductive film over the first metal oxide film;

    a third conductive film over the first metal oxide film;

    an oxide insulating film over the first metal oxide film, the second conductive film and the third conductive film;

    a nitride insulating film over the oxide insulating film; and

    a pixel electrode over the nitride insulating film,wherein the first metal oxide film includes a region overlapping the first conductive film,wherein each of the second conductive film and the third conductive film is electrically connected to the first metal oxide film,wherein the pixel electrode is electrically connected to the third conductive film,wherein the pixel electrode includes a region overlapping the second metal oxide film with the nitride insulating film interposed therebetween,wherein the first metal oxide film includes;

    a third metal oxide film; and

    a fourth metal oxide film over the third metal oxide film,wherein each of the third metal oxide film and the fourth metal oxide film contains In, Ga and Zn,wherein the third metal oxide film includes a region where an atomic ratio of In to Ga satisfies a relation In≥

    Ga, andwherein the fourth metal oxide film includes a region where an atomic ratio of In to Ga satisfies a relation In<

    Ga.

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