Electromagnetic interference containment system

• US 10,238,016 B2
• Filed: 02/28/2017
• Issued: 03/19/2019
• Est. Priority Date: 05/30/2014
• Status: Active Grant

• Current Assignee: Emc IP Holding Company LLC (Dell Technologies Inc.)
• Original Assignee: Emc IP Holding Company LLC (Dell Technologies Inc.)
• Inventors: Frank, Christopher, Olesiewicz, Timothy, Willis, Clifford
• Primary Examiner(s): Hoffberg, Robert J
• Assistant Examiner(s): Dang, Hung
• Application Number:
  US15/445,065
• Publication Number:
  US 20170172017A1
• Time in Patent Office: 749 Days
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: H05K 5/0021 Side-by-side or stacked arrangements
• CPC Class Codes: H05K 5/0026 provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
• CPC Class Codes: H05K 7/1424 Card cages
• CPC Class Codes: H05K 7/1445 with double-sided connections
• CPC Class Codes: H05K 7/20136 Forced ventilation, e.g. by fans H05K7/202 takes precedence
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20563 within sub-racks for removing heat from electronic boards
• CPC Class Codes: H05K 9/0015 Gaskets or seals
• CPC Class Codes: H05K 9/0081 Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence

Abstract

A chassis includes a flash module comprising a cover and an integrated connector, a metal stiffener, an electromagnetic interference (EMI) gasket, and a midplane. The flash module is connected to the midplane using the integrated connector, the integrated connector extends past the cover of the flash module, and, when the flash module is connected to the midplane, the cover of the flash module is in direct contact with the EMI gasket, in which the metal stiffener is interposed between the EMI gasket and the midplane.

Claims

1. An electromagnetic interference (EMI) containment system, comprising:

a chassis, comprising;

a front section, comprising;

a module bay configured to accommodate a plurality of removably insertable flash modules;

a rear section that is EMI contained; and

a separation section that separates the front section from the rear section, the separation section comprising;

a metal stiffener, comprising;

a first plurality of openings, configured to enable airflow between the module bay and the rear section; and

a second plurality of openings; and

a midplane printed circuit board (PCB), disposed between the metal stiffener and the rear section, the midplane PCB having a plurality of holes, each of the holes corresponding to a respective opening of the first plurality of openings to enable the airflow between the module bay and the rear section;

at least one flash module of the plurality of removably insertable flash modules, disposed within the module bay, the at least one flash module comprising;

a cover providing EMI containment to flash module circuits; and

a connector that extends beyond the cover,

wherein upon insertion of the at least one flash module into the module bay;

the connector interfaces with the midplane PCB, through at least one of the second plurality of openings, and

the connector is EMI contained.

2. The chassis of claim 1, wherein the cover of the flash module provides heat dissipation to the flash module circuits.

3. The chassis of claim 2, wherein the airflow removes heat from the cover while traversing through the module bay.

4. The chassis of claim 2, wherein the airflow removes heat from the midplane PCB.

5. A chassis that does not provide chassis level electromagnetic interference (EMI) containment, the chassis comprising:

a module bay that does not provide EMI containment for flash modules disposed in the module bay;

a rear section that does provide EMI containment for elements disposed in the rear section;

a metal stiffener disposed between the module bay and the rear section, the metal stiffener comprising;

a first plurality of holes that enables an airflow between the module bay and the rear section; and

a second plurality of holes, wherein each hole of the second plurality of holes is configured to;

receive a flash module of the flash modules, and

form an electromagnetic seal between the metal stiffener and the flash module; and

a midplane printed circuit board (PCB), disposed between the metal stiffener and the rear section, the midplane PCB having a plurality of holes, each of the holes corresponding to a respective hole of the first plurality of holes, enabling the airflow between the module bay and the rear section,

wherein forming the electromagnetic seal provides the EMI containment for the flash module within the module bay.

6. The chassis of claim 5, wherein the rear section provides front EMI containment on a side of the rear section proximate to the metal stiffener, and wherein the airflow passes through the metal stiffener.

7. The chassis of claim 5, wherein the metal stiffener and a cover of the flash module provide the EMI containment of the flash module, and the module bay allows airflow to pass therethrough.

8. The chassis of claim 7, wherein the module bay does not provide front EMI containment, wherein the airflow passes through a front opening of the module bay.

9. The chassis of claim 5, wherein the module bay comprises a front opening that does not provide EMI containment, the front opening opposite to the metal stiffener.