Radio frequency isolation structure with racetrack

• US 10,242,143 B2
• Filed: 02/17/2016
• Issued: 03/26/2019
• Est. Priority Date: 07/13/2012
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Chen, Howard E., Read, Matthew Sean, Nguyen, Hoang Mong, LoBianco, Anthony James, Zhang, Guohao, Hoang, Dinhphuoc Vu
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US15/046,258
• Publication Number:
  US 20160163661A1
• Time in Patent Office: 1,133 Days
• Field of Search: 361760, 361704, 257508, 257659, 257660, 257774, 455334
• CPC Class Codes: G06F 30/392 Floor-planning or layout, e.g. partitioning or placement
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers amplifiers per se H03F
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1531 : the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/181 : associated with surface mounted components

Abstract

Aspects of the present disclosure relate to a racetrack that forms part of an RF isolation structure of a packaged module and wireless devices that include such a packaged module. The racetrack can be disposed in a substrate and around an RF component that is on the substrate. The racetrack can include at least one break and/or at least one narrowed section without significantly degrading the EMI performance of the RF isolation structure.

Claims

1. A wireless device comprising:

an antenna configured to facilitate at least one of transmitting or receiving a radio-frequency signal;

a packaged module in communication with the antenna, the packaged module including a substrate configured to receive a plurality of components;

a radio frequency component coupled to a major surface of the substrate;

a racetrack in the substrate, the racetrack configured at a ground potential, the racetrack including a continuous portion along a periphery of the packaged module, the continuous portion including a first part and a second part that extends in a direction substantially orthogonal to the first part, and the racetrack having a narrowed section that has a width that is narrower than other portions of the racetrack, the narrowed section of the racetrack being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;

a conductive layer electrically connected to the racetrack such that the racetrack and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer;

a wirebond pad and a wirebond in contact with the conductive layer and the wirebond pad;

and a via in the substrate, the via being disposed between the racetrack and the major surface, and the via being in an electrical path between the racetrack and the wirebond pad; and

an other electronic module in communication with the packaged module.

2. The wireless device of claim 1 wherein the packaged module further includes a second racetrack electrically connected to the racetrack by the via.

3. The wireless device of claim 1 wherein the radio frequency component is configured to emit less electromagnetic radiation to the low radiating area of the packaged module than to other areas of the packaged module.

4. The wireless device of claim 1 wherein the packaged module is configured to receive less electromagnetic radiation at the low radiating area of the packaged module from the other electronic module than at other areas of the packaged module.

5. The wireless device of claim 1 wherein the racetrack has at least one break.

6. The wireless device of claim 1 wherein the radio frequency component includes a high band portion and a low band portion.

7. The wireless device of claim 1 wherein the radio frequency component includes a power amplifier.

8. A packaged module comprising:

a radio frequency component coupled to a major surface of a substrate;

a racetrack in the substrate, the racetrack configured at a ground potential, and the racetrack having a section that has a break or a width that is narrower than other portions of the racetrack, the section that has the break or width that is narrower being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;

a wirebond pad bonded to a wirebond;

a via in the substrate, the via being positioned between the racetrack and the wirebond pad, and the via being in an electrical path between the racetrack and the wirebond pad; and

a conductive layer electrically connected to the wirebond pad by the wirebond such that the racetrack, the wirebond, the via, and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer.

9. The packaged module of claim 8 wherein the radio frequency component includes a power amplifier.

10. The packaged module of claim 8 wherein the section of the racetrack has the break.

11. The packaged module of claim 10 wherein the racetrack has at least a second break.

12. The packaged module of claim 10 wherein the racetrack has another section that has a width that is narrower than other portions of the racetrack.

13. The packaged module of claim 8 further comprising two additional racetracks disposed in different respective layers of the substrate, the two additional racetracks being electrically connected to the racetrack.

14. The packaged module of claim 8 wherein the radio frequency component includes a high band portion and a low band portion.

15. A packaged module comprising:

a radio frequency component coupled to a major surface of a substrate;

a racetrack in the substrate, the racetrack configured at a ground potential, the racetrack including a continuous portion along a periphery of the packaged module, the continuous portion including a first part and a second part that extends in a direction substantially orthogonal to the first part, the racetrack having a narrowed section that has a width that is narrower than other portions of the racetrack, and the narrowed section of the racetrack being located in a low radiating area that is associated with less electromagnetic radiation than the other portions of the racetrack;

a conductive layer electrically connected to the racetrack such that the racetrack and the conductive layer form at least a portion of a radio frequency isolation structure around the radio frequency component, the radio frequency component being positioned between the major surface of the substrate and the conductive layer;

a wirebond pad and a wirebond in contact with the conductive layer and the wirebond pad; and

a via in the substrate, the via being disposed between the racetrack and the major surface, and the via being in an electrical path between the racetrack and the wirebond pad.

16. The packaged module of claim 15 wherein the racetrack has at least one break.

17. The packaged module of claim 15 further comprising wirebonds configured to provide at least a portion of an electrical connection between the racetrack and the conductive layer, the wirebonds including the wirebond, and the radio frequency isolation structure including the wirebonds.

18. The packaged module of claim 15 wherein the radio frequency component includes a high band portion and a low band portion.

19. The packaged module of claim 15 further comprising a second racetrack electrically connected to the racetrack by the via.

20. The packaged module of claim 15 wherein the radio frequency component includes a power amplifier.