System-in-package image sensor

• US 10,243,014 B2
• Filed: 02/20/2018
• Issued: 03/26/2019
• Est. Priority Date: 11/28/2016
• Status: Active Grant

• Current Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Original Assignee: Omnivision Technologies Incorporated (Will Semiconductor Co., Ltd. Shanghai)
• Inventors: Lin, Wei-Feng, Huang, Chi-Chih, Li, En-Chi
• Primary Examiner(s): Ha, Nathan W
• Application Number:
  US15/899,900
• Publication Number:
  US 20180182797A1
• Time in Patent Office: 399 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/1469 Assemblies, i.e. hybrid integration
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

A method of image sensor package fabrication includes forming a cavity in a ceramic substrate, and placing an image sensor in the cavity in the ceramic substrate. An image sensor processor is also placed in the cavity in the ceramic substrate, and the image sensor and the image sensor processor are wire bonded to electrical contacts. Glue is deposited on the ceramic substrate, and a glass layer is placed on the glue to adhere the glass layer to the ceramic substrate. The image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate.

Claims

1. A method of image sensor package fabrication, comprising:

forming a cavity in a ceramic substrate;

placing an image sensor in the cavity in the ceramic substrate;

placing an image sensor processor in the cavity in the ceramic substrate;

wire bonding the image sensor and the image sensor processor to electrical contacts;

depositing glue on the ceramic substrate; and

placing a glass layer on the glue to adhere the glass layer to the ceramic substrate, wherein the image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate;

placing an interposer in the cavity, wherein the cavity includes ledges and wherein the interposer is attached to the ledges of the ceramic substrate, wherein placing the image sensor and the image sensor processor in the cavity includes wire bonding the image sensor and the image sensor processor to the interposer, and wherein the image sensor and the image sensor processor are disposed on an illuminated side of the interposer, and wherein an application-specific integrated circuit is disposed on a dark side of the interposer opposite the illuminated side.

2. The method of claim 1, wherein the interposer includes silicon.

3. A method of image sensor package fabrication, comprising:

forming a cavity in a ceramic substrate;

placing an image sensor in the cavity in the ceramic substrate;

placing an image sensor processor in the cavity in the ceramic substrate;

wire bonding the image sensor and the image sensor processor to electrical contacts;

depositing glue on the ceramic substrate; and

placing a glass layer on the glue to adhere the glass layer to the ceramic substrate, wherein the image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate, wherein the cavity includes ledges, and wherein the image sensor is placed on the ledges so that the image sensor is disposed between the glass layer and the image sensor processor, wherein the image sensor processor is disposed on a planar surface of the ceramic substrate.

4. The method of claim 3, wherein wire bonding includes wire bonding to contact pads disposed in the cavity in the ceramic substrate.

5. A method of image sensor package fabrication, comprising:

forming a cavity in a ceramic substrate;

placing an image sensor in the cavity in the ceramic substrate;

placing an image sensor processor in the cavity in the ceramic substrate;

wire bonding the image sensor and the image sensor processor to electrical contacts;

depositing glue on the ceramic substrate; and

placing a glass layer on the glue to adhere the glass layer to the ceramic substrate, wherein the image sensor processor and the image sensor are disposed in the cavity between the glass layer and the ceramic substrate;

placing an application-specific integrated circuit in the cavity in the ceramic substrate and wire bonding the application-specific integrated circuit to the electrical contacts, wherein the application-specific integrated circuit, the image sensor, and the image sensor processor are disposed on a level plane within the cavity so that the image sensor is disposed between the application-specific integrated circuit and the image sensor processor.