Substrate features for enhanced fluidic assembly of electronic devices
First Claim
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1. A fluidic assembly system, the system comprising:
- a substrate including a an plurality of polygonal wells, wherein each of the polygonal wells has a sidewall defining an polygonal outer perimeter of the respective polygonal well and extending from one surface of the substrate to a depth within the substrate, and wherein each of the polygonal wells is sized to accept a single disk shaped device; and
a through hole via extending from at least one of the plurality of polygonal wells through the substrate to another surface of the substrate, wherein the through hole via extends from an out of boundary area of the at least one of the plurality of wells, and wherein the out of boundary area is incapable of being fully covered by the disk shaped device when disk shaped device is deposited in the well.
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Abstract
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
51 Citations
22 Claims
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1. A fluidic assembly system, the system comprising:
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a substrate including a an plurality of polygonal wells, wherein each of the polygonal wells has a sidewall defining an polygonal outer perimeter of the respective polygonal well and extending from one surface of the substrate to a depth within the substrate, and wherein each of the polygonal wells is sized to accept a single disk shaped device; and a through hole via extending from at least one of the plurality of polygonal wells through the substrate to another surface of the substrate, wherein the through hole via extends from an out of boundary area of the at least one of the plurality of wells, and wherein the out of boundary area is incapable of being fully covered by the disk shaped device when disk shaped device is deposited in the well. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A fluidic assembly substrate, the substrate comprising:
a plurality of wells each including; a well opening at a first surface of the substrate, wherein the well opening has a first cross-sectional area; a through hole via having a via opening with a second cross-sectional area, wherein the through hole via extends from the well to a second surface of the substrate, wherein the second cross-sectional area is less than the first cross-sectional area; and wherein the through hole via is located below the first cross-sectional area such that a post of a post enhanced diode is incapable of insertion into the through hole via when at least a portion of a diode structure of the post enhanced diode and a portion of the post of the post enhanced diode are deposited in the well. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A fluidic assembly system, the system comprising:
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a plurality of post enhanced diodes, wherein each of the post enhanced diodes include a diode structure and a post extending from the diode structure; a substrate including a plurality of wells, wherein each of the wells has; a sidewall defining an outer perimeter of the well and extending from a first surface of the substrate to a depth within the substrate, and wherein each of the wells is sized to accept a single post enhanced diode; a through hole via having extending from the well to a second surface of the substrate; and wherein the through hole via is located below the first cross-sectional area such that a post of a post enhanced diode is incapable of insertion into the through hole via when at least a portion of a diode structure of the post enhanced diode is deposited in the well. - View Dependent Claims (18, 19, 20, 21, 22)
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Specification