Tightly-coupled near-field communication-link connector-replacement chips

• US 10,243,621 B2
• Filed: 08/16/2017
• Issued: 03/26/2019
• Est. Priority Date: 12/23/2008
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D.
• Primary Examiner(s): Tran, Tuan A
• Application Number:
  US15/679,125
• Publication Number:
  US 20180026681A1
• Time in Patent Office: 587 Days
• Field of Search: None
• CPC Class Codes: H04B 5/48 Transceivers

Abstract

Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.

Claims

1. A system comprising:

a backplane;

an electronic device aligned to the backplane;

a first chip of the backplane, the chip comprising a transmitter coupled to a first antenna;

a second chip of the electronic device, the second chip comprising a receiver coupled to a second antenna, the first antenna near field coupling with the second antenna at an EHF frequency, such that the transmitter of the first chip communicates with the receiver of the second chip at the EHF frequency; and

a third chip of the backplane near field coupled to a fourth chip of the electronic device, such that the third chip communicates with the fourth chip at the EHF frequency.

2. The system of claim 1, wherein the second chip is at an edge of the electronic device that is adjacent to the backplane.

3. The system of claim 1, wherein the first chip and the second chip are oriented at zero degrees relative to each other.

4. The system of claim 1, wherein the first chip and the second chip are oriented at 90 degrees relative to each other.

5. The system of claim 1, wherein the first chip is spaced 2 mm to 5 mm from the second chip.

6. The system of claim 1:

wherein the first chip is a first transceiver chip comprising the transmitter and an additional receiver coupled to the first antennae; and

wherein the second chip is a second transceiver chip comprising the receiver and an additional transmitter coupled to the second antennae.

7. The system of claim 1, wherein the electronic device aligned to the backplane is a line card aligned to the backplane.

8. The system of claim 1, wherein the electronic device comprises a printed circuit board and the second chip is mounted to the printed circuit board.

9. The system of claim 1, wherein the electronic device is rectangular shaped and is oriented perpendicular to the backplane.

10. The system of claim 1, wherein the first chip is coupled to a differential signal conduction path of the backplane.

11. The system of claim 1, further comprising:

a rack aligning the electronic device to the backplane.

12. The system of claim 11, wherein the electronic device is slide-able within the rack.

13. The system of claim 1, wherein the first chip and the first antennae are in a first chip package, and the second chip and the second antennae are in a second chip package.

14. The system of claim 1, wherein the first chip comprises an EHF oscillator.