Proximity sensor and manufacturing method therefor
First Claim
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1. A proximity sensor, comprising:
- a substrate having a first surface;
a sensor chip coupled to the first surface of the substrate, the sensor chip having a sensor region on a surface of the sensor chip;
a layer of glass over the sensor region;
a transparent adhesive coupling the layer of glass to the sensor region of the sensor chip;
a light-emitting device coupled to the substrate by conductive wires, the light-emitting device having a light emitting surface;
transparent molding material sealing the light-emitting device and the conductive wires; and
non-transparent molding material on the surface of the sensor chip and not on the sensor region, the non-transparent molding material abutting a surface of the transparent molding material, a side surface of the layer of glass, and a side surface of the sensor chip, wherein the non-transparent molding material is on the substrate between the transparent molding material and the sensor chip.
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Abstract
A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding material separating the transparent molding material from the sensor chip.
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Citations
14 Claims
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1. A proximity sensor, comprising:
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a substrate having a first surface; a sensor chip coupled to the first surface of the substrate, the sensor chip having a sensor region on a surface of the sensor chip; a layer of glass over the sensor region; a transparent adhesive coupling the layer of glass to the sensor region of the sensor chip; a light-emitting device coupled to the substrate by conductive wires, the light-emitting device having a light emitting surface; transparent molding material sealing the light-emitting device and the conductive wires; and non-transparent molding material on the surface of the sensor chip and not on the sensor region, the non-transparent molding material abutting a surface of the transparent molding material, a side surface of the layer of glass, and a side surface of the sensor chip, wherein the non-transparent molding material is on the substrate between the transparent molding material and the sensor chip. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An electronic apparatus, comprising:
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a proximity sensor including; a substrate having a first surface; a sensor chip coupled to the first surface, the sensor chip including a sensor region on a surface of the sensor chip; a layer of glass over the sensor region; a transparent adhesive coupling the layer of glass to the sensor region of the sensor chip; a light-emitting device coupled to the first surface, the light-emitting device having a light emitting surface; transparent molding material sealing light-emitting device; non-transparent molding material on the surface of the sensor chip but not on the sensor region of the sensor chip, the non-transparent molding material located abutting a surface of the transparent molding material, a side surface of the layer of glass, and a side surface of the sensor chip; and a controller coupled to the proximity sensor. - View Dependent Claims (8, 9, 10)
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11. A method for manufacturing a proximity sensor, comprising:
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coupling a light-emitting device to a surface of a substrate; electrically coupling the light-emitting device to the substrate by first conductive elements; in a first molding process, sealing the light-emitting device and the first conductive elements in a transparent molding material; coupling a sensor chip to the surface of the substrate, the sensor chip having a surface that includes a sensor region; electrically coupling the sensor chip to the substrate by second conductive elements; covering a sensor region of the sensor chip with a layer of glass, wherein a remaining portion of the surface remains uncovered from the layer of glass; and in a second molding process, molding a non-transparent molding material on the substrate and the remaining portion of the surface of the sensor chip such that the non-transparent molding material covers a portion of the transparent molding material and a portion of the layer of glass and is between the transparent molding material and the sensor chip so that the non-transparent molding material abuts a side surface of the sensor chip and abuts a side surface of the transparent molding material. - View Dependent Claims (12, 13, 14)
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Specification