Distributed sensor system

• US 10,246,322 B2
• Filed: 03/12/2014
• Issued: 04/02/2019
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Versana Micro Inc.
• Original Assignee: Versana Micro Inc.
• Inventors: Gogoi, Bishnu Prasanna
• Primary Examiner(s): McFadden, Michael P
• Application Number:
  US14/207,477
• Publication Number:
  US 20140268524A1
• Time in Patent Office: 1,847 Days
• Field of Search: 361749, 361760, 361783, 361784, 361789, 361790, 361792, 361804
• CPC Class Codes: B81B 2201/0207 Bolometers
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/0228 Inertial sensors
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/05 Arrays
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: H01L 27/14 including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation radiation-sensitive components structurally associated with one or more electric light sources only H01L31/14; couplings of light guides with optoelectronic elements G02B6/42
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: H10B 61/00 Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
• CPC Class Codes: H10N 19/00 Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/308 Membrane type
• CPC Class Codes: H10N 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 MRAM devices H10B61/00

Abstract

A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able to collect data about the environment in a distributed manner. An example of a distributed sensor system comprises a first sensor node and a second sensor node. Each sensor node has a plurality of sensors or a MIMS device. Each sensor node can also include electronic circuitry or a power source. A joint region is coupled between a first flexible interconnect region and a second flexible interconnect region. The first sensor node is coupled to the first flexible interconnect region. Similarly, the second sensor node is coupled to the second flexible interconnect region.

Claims

1. A distributed sensor system comprising:

a first sensor node comprising a plurality of sensors formed on or coupled to a substrate;

a first flexible interconnect region coupled to the first sensor node;

a first joint region coupled to the first flexible interconnect region;

a second flexible interconnect region coupled to the first joint region; and

a second sensor node coupled to the second flexible interconnect wherein the first joint region is configured to be decoupled from the first flexible interconnect region or the second flexible interconnect region wherein the first joint region is replaced with a second joint region that is shorter or longer than the first joint region when recoupled to the first flexible interconnect region or the second flexible interconnect region such that the length between the first sensor node and the second sensor node is decreased or increased.

2. The distributed sensor system of claim 1 wherein the first joint region has a first length and wherein in the second joint region is the first joint region shortened to a second length that is shorter than the first length.

3. The distributed sensor system of claim 1 wherein the at least one joint region, the first flexible interconnect, or the second flexible interconnect comprises a metal or a metal alloy that enables the scaling of the length of the distributed sensor system.

4. The distributed sensor system of claim 3 wherein the metal or metal alloy of the first joint region comprises at least one of Au/Sn, Sn/Ag/Cu, Sn/Ag, or a solder.

5. The distributed sensor system of claim 1 wherein the first or second flexible interconnect regions comprises parylene that supports multi-axis degrees of freedom, and wherein the first or second flexible interconnect regions includes conductive traces.

6. The distributed sensor system of claim 1 further including an attachment region wherein the attachment region is coated with an adhesion layer.

7. The distributed sensor system of claim 6 further including a plurality of adhesion layers separated by protective layers and wherein a spent or decoupled adhesion layer can be removed by removing an underlying protective layer thereby exposing a new adhesion layer.

8. The distributed sensor system of claim 6 wherein the adhesion layer is activated by ultraviolet light.

9. The distributed sensor system of claim 1 wherein the first joint region is configured to couple by a local vacuum and wherein the first joint region is configured to be decoupled by overcoming the local vacuum.

10. The distributed sensor system of claim 1 wherein the first joint region is configured to couple by micro-rivets or pins or wherein the first joint region is configured to couple by a micro-velcro structure or wherein the first joint region can be decoupled by overcoming the micro-velcro structure.

11. The distributed sensor system of claim 1 wherein the first joint region is configured to be coupled by magnetic force and wherein the first joint region is configured to be decoupled by overcoming the magnetic force.

12. A distributed sensor system comprising a plurality of sensor nodes coupled together by a plurality of flexible interconnect regions, wherein the plurality of flexible interconnect regions are configured to provide multiple degrees of freedom that support following surface contours or sudden changes of direction, where the flexible interconnect comprises a polymer, wherein the distributed sensor system further includes a joint region coupled between at least two sensor nodes of the plurality of sensor nodes, wherein the joint region is configured to be decoupled and recoupled to support shortening or lengthening a distance between the two sensor nodes of the plurality of sensor nodes, wherein the joint region is configured to be replaced with a longer joint region, and wherein the longer joint region is configured to be recoupled between the two sensor nodes of the plurality of sensor nodes.

13. The distributed sensor system of claim 12 wherein the joint region is configured to be shortened and wherein the shortened joint region is configured to be recoupled to shorten the distance between the two sensor nodes of the plurality sensor nodes.

14. The distributed sensor system of claim 13 wherein one or more joint regions are configured to be coupled between the at least two sensor nodes to increase or decrease a distance between the at least two sensor nodes.

15. The distributed sensor system of claim 12 wherein the joint region couples to at least one of the plurality of flexible interconnect region and includes conductive traces that enables the scaling of the length of the distributed sensor.

16. The distributed sensor system of claim 15 further including an attachment region wherein the attachment region is coated with an adhesion layer that retains the at least one joint region to the attachment region.

17. The distributed sensor system of claim 16 wherein the joint region or the attachment region includes a plurality of adhesion layers separated by protective layers and wherein a spent or decoupled adhesion layer can be removed by removing an underlying protective layer thereby exposing a new adhesion layer.

18. The distributed sensor system of claim 16 wherein the adhesion layer is activated by ultraviolet light.

19. The distributed sensor system of claim 12 wherein at least one of the plurality of flexible interconnect regions is configured to be coupled by magnetic force and wherein the at least one of the plurality of flexible interconnect is configured to be decoupled by overcoming the magnetic force.

20. A distributed sensor system comprising:

a plurality of sensor nodes;

an interconnect regions coupled to at least one of the plurality of sensor nodes; and

a joint region coupled between two sensor nodes of the plurality of sensor nodes wherein the joint region is configured to be coupled, decoupled, and recoupled to lengthen or shorten a distance between the two sensor nodes of the plurality of sensor nodes in the distributed sensor system wherein the joint is configured to be shortened and recoupled to shorten the distance between the two sensor nodes.