Multilayer structure with embedded multilayer electronics

• US 10,248,277 B2
• Filed: 10/10/2018
• Issued: 04/02/2019
• Est. Priority Date: 04/13/2016
• Status: Active Grant

• Current Assignee: TactoTek Oy
• Original Assignee: TactoTek Oy
• Inventors: Saaski, Jarmo, Torvinen, Jarkko, Raappana, Pasi, Heikkinen, Mikko
• Primary Examiner(s): Sheng, Tom V
• Application Number:
  US16/156,008
• Publication Number:
  US 20190042030A1
• Time in Patent Office: 174 Days
• CPC Class Codes: B29C 39/12 Making multilayered or multicoloured articles B29C39/021 takes precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/14819 the inserts being completely encapsulated
• CPC Class Codes: B29C 45/16 Making multilayered or multicoloured articles B29C45/0062 takes precedence; feeding colouring materials into the injection unit B29C45/1816
• CPC Class Codes: B29L 2031/34 Electrical apparatus, e.g. sparking plugs or parts thereof
• CPC Class Codes: B32B 15/082 comprising vinyl resins; comprising acrylic resins
• CPC Class Codes: B32B 15/085 comprising polyolefins
• CPC Class Codes: B32B 15/088 comprising polyamides
• CPC Class Codes: B32B 15/09 comprising polyesters
• CPC Class Codes: B32B 15/14 next to a fibrous or filamentary layer
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 2250/05 5 or more layers
• CPC Class Codes: B32B 2255/02 on fibrous or filamentary layer
• CPC Class Codes: B32B 2255/06 on metal layer
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/204 Di-electric
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2307/304 Insulating
• CPC Class Codes: B32B 2307/41 Opaque
• CPC Class Codes: B32B 2307/412 : Transparent
• CPC Class Codes: B32B 2307/414 : Translucent
• CPC Class Codes: B32B 2307/416 : Reflective
• CPC Class Codes: B32B 2307/418 : Refractive
• CPC Class Codes: B32B 2307/536 : Hardness
• CPC Class Codes: B32B 2307/546 : Flexural strength; Flexion stiffness
• CPC Class Codes: B32B 2307/58 : Cuttability
• CPC Class Codes: B32B 2307/732 : Dimensional properties
• CPC Class Codes: B32B 2307/738 : Thermoformability
• CPC Class Codes: B32B 2307/75 : Printability
• CPC Class Codes: B32B 2457/00 : Electrical equipment
• CPC Class Codes: B32B 27/06 : as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: B32B 27/08 : of synthetic resin
• CPC Class Codes: B32B 27/10 : of paper or cardboard
• CPC Class Codes: B32B 27/12 : next to a fibrous or filamentary layer
• CPC Class Codes: B32B 27/281 : comprising polyimides
• CPC Class Codes: B32B 27/302 : comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
• CPC Class Codes: B32B 27/308 : comprising acrylic (co)polymers
• CPC Class Codes: B32B 27/32 : comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 27/34 : comprising polyamides
• CPC Class Codes: B32B 27/36 : comprising polyesters
• CPC Class Codes: B32B 27/365 : comprising polycarbonates
• CPC Class Codes: B32B 29/02 : next to a fibrous or filamentary layer
• CPC Class Codes: B32B 29/08 : Corrugated paper or cardboard
• CPC Class Codes: B32B 3/06 : for securing layers together; for attaching the product to another member, e.g. to a support , or to another product, e.g. groove/tongue, interlocking
• CPC Class Codes: B32B 3/266 : characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
• CPC Class Codes: B32B 3/30 : characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs apertured layer B32B3/266; layer with cavities or internal voids B32B3/26
• CPC Class Codes: B32B 5/02 : characterised by structural features of a fibrous or filamentary layer layer formed of metallic wires B32B15/02; layer formed of natural mineral fibres B32B19/02; layer formed of wood fibres B32B21/02
• CPC Class Codes: B32B 5/26 : another layer next to it also being fibrous or filamentary relative arrangement of fibres or filaments of different layers B32B5/12
• CPC Class Codes: B32B 7/023 : Optical properties
• CPC Class Codes: B32B 9/025 : comprising leather
• CPC Class Codes: B32B 9/04 : comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a glass layer B32B17/06; layered products with at least two ceramic layers composed mainly of ceramic B32B18/00
• CPC Class Codes: B32B 9/041 : of metal
• CPC Class Codes: B32B 9/045 : of synthetic resin
• CPC Class Codes: B32B 9/047 : made of fibres or filaments
• CPC Class Codes: B32B 9/06 : of paper or cardboard
• CPC Class Codes: G06F 2203/04101 : 2.5D-digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface and also measures the distance of the input means within a short range in the Z direction, possibly with a separate measurement setup
• CPC Class Codes: G06F 2203/04103 : Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/017 : Gesture based interaction, e.g. based on a set of recognized hand gestures interaction based on gestures traced on a digitiser G06F3/04883
• CPC Class Codes: G06F 3/03547 : Touch pads, in which fingers can move on a surface
• CPC Class Codes: G06F 3/041 : Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 : using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/04883 : for inputting data by handwriting, e.g. gesture or text
• CPC Class Codes: H01L 21/565 : Moulds
• CPC Class Codes: H01L 23/538 : the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H05K 1/0266 : Marks, test patterns or identification means
• CPC Class Codes: H05K 1/0274 : Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0313 : Organic insulating material
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/0108 : Transparent
• CPC Class Codes: H05K 2201/042 : Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/09118 : Moulded substrate
• CPC Class Codes: H05K 2201/09936 : Marks, inscriptions, etc. for information
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10121 : Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10151 : Sensor
• CPC Class Codes: H05K 2201/10295 : Metallic connector elements partly mounted in a hole of the PCB
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 2203/1305 : Moulding and encapsulation
• CPC Class Codes: H05K 2203/1316 : Moulded encapsulation of mounted components
• CPC Class Codes: H05K 2203/1327 : Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/12 : using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/285 : Permanent coating compositions
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/46 : Manufacturing multilayer circuits

Abstract

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

Claims

1. An integrated multilayer assembly for an electronic device comprising:

a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;

a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side, the first sides of the first and second substrate films being configured to face each other, at least one of the first or second substrate films preformed to a three-dimensional, non-planer, shape;

at least one electrical feature on the first side of the first substrate film;

at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component; and

a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

2. The assembly of claim 1, wherein one of the at least one electrical feature on the first substrate film comprises a first sensing element for detecting touch on the assembly surface.

3. The assembly of claim 2, wherein the first sensing element comprises a first electrode.

4. The assembly of claim 2, wherein one of the at least one other electrical feature on the second substrate film comprises a second sensing element, the first and second sensing elements being collectively configured to detect touch or gesture.

5. The assembly of claim 4, wherein the second sensing element comprises a second electrode.

6. The assembly of claim 1, further comprising at least one protective layer on at least one of the first or second substrate films.

7. The assembly of claim 1, wherein at least one of the first or second substrate films comprises a window of optically opaque, translucent, or transparent material having regard to a predetermined frequency or frequency band.

8. The assembly of claim 1, wherein at least one of the first or second substrate films comprises a window of through-hole type with no fill material.

9. The assembly of claim 1, wherein the substrate film includes at least one material selected from the group consisting of:

polymer, thermoplastic material, PMMA (Polymethyl methacrylate), Poly Carbonate (PC), polyimide, a copolymer of Methyl Methacrylate and Styrene (MS resin), glass, organic material, fibrous material, Polyethylene Terephthalate (PET), and metal.

10. The assembly of claim 1, wherein the molded plastic layer includes at least one material selected from the group consisting of:

PC, PMMA, ABS, PET, nylon (PA, polyamide), polypropylene (PP), polystyrene (GPPS), elastomeric resin, and MS resin.

11. The assembly of claim 1, wherein the electrical features located on the first or second substrate film comprise at least one element selected from the group consisting of:

conductive trace, printed conductive trace, contact pad, component, integrated circuit (chip), processing unit, memory, communication unit, transceiver, transmitter, receiver, signal processor, microcontroller, battery, light emitting device, light sensing device, photodiode, connector, electrical connector, optical connector, diode, OLED (Organic LED), printed electronic component, sensor, force sensor, antenna, accelerometer, gyroscope, capacitive switch or sensor, electrode, sensor electrode, printed sensor electrode, and photovoltaic cell.

12. A method of establishing an integrated multilayer assembly for an electronic device comprising:

obtaining a first substrate film configured to accommodate electrical features on at least a first side thereof, the first substrate film having the first side and a second side opposite the first side;

obtaining a second substrate film configured to accommodate electrical features on at least a first side thereof, the second substrate film having the first side and a second side opposite the first side;

providing at least one electrical feature on the first side of the first substrate film;

providing at least one other electrical feature on the first side of the second substrate film, wherein at least one of the at least one electrical feature or the at least one other electrical feature is a mounted electronic component;

forming at least one of the first or second substrates into a selected substantially non-planar three-dimensional shape subsequent to providing the at least one electrical feature thereon;

arranging the first and second substrate films in a mold so that the first sides thereof face each other in spaced relation subsequent to forming the at least one of the first or section substrates into the selected substantially non-planar three-dimensional shape; and

molding a plastic layer between the first and second substrate films and at least partially embedding the electrical features on the first sides thereof.

13. The method of claim 12, wherein the provision of the at least one electrical feature comprises mounting or additively printing a first sensing element.

14. The method of claim 13, wherein the first sensing element comprises a first electrode for sensing touch or gesture upon the assembly.

15. The method of claim 14, wherein the first substrate film is configured as a front film, when in use, facing the environment and potential objects to be sensed therein.

16. The method of claim 13, wherein the provision of the at least one other electrical feature comprises mounting or additively printing a second sensing element.

17. The method of claim 16, wherein the second sensing element comprises a second electrode for sensing touch or gesture upon the assembly in combination with the first sensing element.

18. The method of claim 17, wherein the first and second sensing elements are spatially configured to overlap in the thickness direction of the assembly.

19. An integrated multilayer assembly for an electronic device comprising:

a first substrate film having a first side and a second side opposite the first side;

a first electrical feature on the first side of the first substrate film;

a second substrate film having a first side and a second side opposite the first side, the first sides of the first and second substrate films opposing one another, wherein at least one of the first or second substrate films is preformed to a three-dimensional, non-planer, shape and wherein at least one of the first or second substrate films comprises a window of optically opaque, translucent, or transparent material having regard to a predetermined frequency or frequency band;

a second electrical feature on the first side of the second substrate film, at least one of the first or second electrical feature being a mounted electronic component; and

a molded plastic layer between the first and second substrate films at least partially embedding the first and second electrical feature.