Semiconductor device, system in package, and system in package for vehicle
First Claim
1. A semiconductor system in package comprising:
- a plurality of semiconductor integrated circuits including a first semiconductor integrated circuit; and
a package substrate having a first surface on which the semiconductor circuits are mounted,wherein a coefficient of thermal expansion of the first semiconductor integrated circuit is different from a coefficient of thermal expansion of the package substrate,wherein the package substrate includes electrodes for a plurality of soldering balls on a second surface opposite to the first surface where the semiconductor integrated circuits are mounted, andwherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to a length of at least one side of a fringe of the first semiconductor integrated circuit.
1 Assignment
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Accused Products
Abstract
The object is to suppress rupture of the soldering balls when an atmosphere varying from a high temperature to a low temperature is repeated. A semiconductor device includes a semiconductor integrated circuit and a substrate. The semiconductor integrated circuit is, for example, a semiconductor chip. The coefficient of thermal expansion is different between the semiconductor integrated circuit and the substrate. The substrate includes a plurality of soldering balls on the opposite surface to the surface where the semiconductor integrated circuit is mounted. The substrate does not have the soldering balls at a position corresponding to at least one side of the fringe of the semiconductor integrated circuit.
13 Citations
10 Claims
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1. A semiconductor system in package comprising:
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a plurality of semiconductor integrated circuits including a first semiconductor integrated circuit; and a package substrate having a first surface on which the semiconductor circuits are mounted, wherein a coefficient of thermal expansion of the first semiconductor integrated circuit is different from a coefficient of thermal expansion of the package substrate, wherein the package substrate includes electrodes for a plurality of soldering balls on a second surface opposite to the first surface where the semiconductor integrated circuits are mounted, and wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to a length of at least one side of a fringe of the first semiconductor integrated circuit. - View Dependent Claims (2, 3, 4, 5, 8)
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6. A semiconductor system in package comprising:
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a plurality of semiconductor integrated circuits including a first semiconductor integrated circuit; and a package substrate having a first surface on which the semiconductor circuits are mounted, wherein a coefficient of thermal expansion of the first semiconductor integrated circuit is different from a coefficient of thermal expansion of the package substrate, wherein the package substrate includes electrodes for a plurality of soldering balls on a second surface opposite to the first surface where the semiconductor integrated circuits are mounted, wherein the package substrate further includes the electrodes for soldering balls used as dummy terminals at positions corresponding to corners of at least one side of a fringe of the first semiconductor integrated circuit, and wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to a length of the at least one side of the fringe of the first semiconductor integrated circuit other than the corners. - View Dependent Claims (9)
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7. A semiconductor system in package for a vehicle comprising:
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a semiconductor integrated circuit which receives sensor information from at least one on-vehicle sensor; at least one memory element used by the semiconductor integrated circuit; and a package substrate having a first surface on which the semiconductor integrated circuit and the at least one memory element are mounted, wherein a coefficient of thermal expansion of the semiconductor integrated circuit is different from a coefficient of thermal expansion of the package substrate, wherein the package substrate includes electrodes for a plurality of soldering balls on a second surface opposite to the first surface where the semiconductor integrated circuit and the at least one memory element are mounted, and wherein the package substrate does not have the electrodes for the soldering balls at a position corresponding to a length of at least one side of a fringe of the semiconductor integrated circuit. - View Dependent Claims (10)
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Specification